Thickness measurement - Optical sensor 'CHRocodile 2DW series'
Use an appropriate light source wavelength for doped wafers to accommodate challenging doped wafer thickness measurements.
The "CHRocodile 2DW Series" is a device that can non-contact measure the thickness of materials such as wafers and coatings. It is capable of measuring doped wafers and can be applied in-line, with a proven track record among many customers. In addition to measuring the thickness of semiconductor wafers like sapphire, Si, and SiC, it can also measure the thickness of films, resins, glass, and solar cells. It supports interference film thickness of up to 16 layers. 【Features】 ■ Wide range of thickness measurement, compatible with various materials With a rich lineup of probes, it covers thickness from thin films (a few micrometers) to thick films (780 micrometers). It supports doped wafers. ■ High resolution (sub-micron, minimum 1nm) ■ Contributes to reducing development costs and shortening development lead times, with a software development kit (DLL, etc.) available for device integration ■ Extensive track record in the semiconductor industry *For more details, please refer to the documentation. Feel free to contact us with any inquiries.
basic information
【Other Features】 ■Measurement Range: 2DW1000 50μm–8000μm (n=1) 2DW500 30μm–4000μm (n=1) 2DW250 15μm–2000μm (n=1) ■Resolution: Up to 1nm (n=1) ■Interface: Ethernet, RS422, Analog (2ch) *For more details, please refer to the PDF document or feel free to contact us.
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【Applications】 ■Thickness measurement of semiconductor wafers such as Si, GaAs, SiC, sapphire, etc. Thickness measurement of films, resins, glass, liquid crystal gap cells, solar cells, etc., and measurement of doped wafers. *For more details, please refer to the PDF document or feel free to contact us. 【Keywords for Applications, Measurement Items, Benefits, etc.】 Non-contact sensors, optical sensors, optical sensors, spectral interference method, thickness, thin films, thick films, gaps, shapes, measurement, inspection, high speed, high precision, inline, monitoring, in-situ, during processing, before and after processing, polishing, semiconductors, wafers, wafer bonding, Si wafers, Si, GaAs, InP, SiC, LiNbO3 (LN), LiTaO3 (LT), GaN, SiP, Al2O3 (sapphire), doped wafers, impurity wafers, transparent, transparency, gloss, mirror finish, easy.
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Semicon Japan 2024
We will be exhibiting at Semicon Japan 2024, which will be held at Tokyo Big Sight from December 11 (Wednesday) to December 12 (Friday). If you are interested, please come to the venue. ■ Products to be exhibited 1. Spectral interference optical thickness sensor CHRocodile 2 DW/ 2IT 2. Area scanner for measuring the thickness and shape of 12" wafers - Flying Spot Scanner (FSS) 3. Chromatic aberration confocal optical line sensor CLS2.0 4. Chromatic aberration confocal line camera CVC 5. Chromatic aberration confocal optical single-point sensor CHRocodile Mini 6. Non-contact thickness measurement sensor for opaque materials Enovasnese 7. Sensor for detecting internal defects non-contactly - Field sensor
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The 1st Kyushu Semiconductor Industry Exhibition
We will be exhibiting at the Kyushu Semiconductor Industry Exhibition held at Marine Messe Fukuoka on September 25 (Wednesday) and September 26 (Thursday), 2024. If you are interested, please come to the venue. ■ Products to be exhibited - Spectral interference optical thickness sensor CHRocodile 2 DW/2IT - Chromatic aberration confocal optical line sensor CLS2.0 - Chromatic aberration confocal optical single-point sensor CHRocodile 2S, C, Mini *This time, there will be no actual display of the FSS for 12" wafer thickness mapping measurement, but if you need an explanation or would like to request a demo, please come to our booth.
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Presitech is a specialist in laser material processing and optical measurement technology. We are not just a supplier of systems and components, but a professional partner in ensuring a smooth processing process for our customers. We offer consultations from the foundational stage and accurately consult with customers on their requests and objectives. We understand that the key to success in unique processing processes lies in the four components of exhibition, monitoring, processing, and control. Only by doing so can we provide appropriate solutions for our customers' applications. Our high-quality products, such as laser processing heads, quality monitoring systems, and optical measurement systems for spacing/thickness measurement, allow customers to directly benefit from our decades of experience. Our optical sensors are characterized by the highest precision and dynamic adaptability. Furthermore, they detect accurate values even in high-speed measurements.