CHRocodile 2DPS＋CHRocodile 2IT
Introduction of wafer thickness measurement sensors for semiconductor in-process applications!
This document provides information about wafer thickness measurement sensors. We introduce the "CHRocodile 2 Series," which is suitable for replacement with contact gauges, as well as the design of optical measurement heads for in-process semiconductor applications. Please take a moment to read it. 【Contents】 ■ CHRocodile 2 Series ■ Design of optical measurement heads for in-process semiconductor applications ■ Advantage: Use of chromatic aberration confocal principle ■ Advantage: Use of spectral interference principle ■ Si thickness measurement data during wafer in-process *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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[Keywords: Applications, Measurement Items, Benefits, etc.] Non-contact sensors, optical sensors, confocal, spectral interferometry, thickness, thin films, thick films, height, step height, flatness, TTV, thickness measurement, thickness inspection, high speed, 3D, high precision, inline, monitoring, in-situ, during processing, before and after processing, polishing, semiconductors, semiconductor wafers, wafer bonding, Si wafers, Si, GaAs, InP, SiC, LiNbO3 (LN), LiTaO3 (LT), GaN, SiP, Al2O3 (sapphire), gloss, mirror finish, easy.
