Non-contact thickness measurement optical sensor "CHRocodile 2 Series"
A wide range of probes that can measure with high precision from thin films (a few micrometers) to thick films (780 micrometers). Suitable for wafer inspection applications as well.
The "CHRocodile 2 series" is a non-contact sensor capable of in-process measurement of wafer thickness with sub-micron resolution. It is also used for quality control through sampling. In addition to the semiconductor industry, it is adopted in consumer electronics, glass manufacturing, and the medical field, making it suitable for measuring the thickness of transparent materials, coating thickness, and simultaneous measurement of multiple layers (up to 16 layers). 【Features】 - Wide range of thickness measurement, compatible with various materials A rich lineup of probes covers thickness from thin films (a few micrometers) to thick films (780 micrometers). Two principle methods can be selected according to the material. - High resolution (sub-micron, minimum 1nm) High-resolution measurements based on "chromatic aberration confocal method" and "spectral interference method." - Contributes to reducing development costs and shortening development lead times, with a software development kit (DLL, etc.) available for equipment integration. - Extensive track record across multiple industries Semiconductor industry, consumer electronics, glass manufacturing, medical field. *For more details, please refer to the materials. Feel free to contact us with any inquiries.
basic information
【Lineup】 <CHRocodile 2 DPS (Chromatic Aberration Confocal Method)> - Light source: White LED - Measurement range from 100μm to 38.5mm using a probe - Capable of measuring overall thickness regardless of material <CHRocodile 2 IT (Spectral Interference Principle Method)> - Light source: Infrared SLD - Capable of measuring thickness up to 16 layers - Compatible with polished wafers <CHRocodile 2 DW (Spectral Interference Principle Method)> - Light source: Infrared SLD - Supports a wide range of thicknesses - Compatible with doped wafers *For more details, please refer to the materials. Feel free to contact us with any inquiries.
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[Keywords: Applications, Measurement Items, Benefits, etc.] Non-contact sensors, optical sensors, confocal, spectral interference method, thickness, thin films, thick films, gaps, height, surface roughness, flatness, TTV, shape, appearance, edges, slopes, measurement, inspection, high speed, 3D, high precision, inline, monitoring, in-situ, during processing, before and after processing, polishing, offline, standalone machines, tabletop machines, sampling, embedded, semiconductors, wafers, wafer bonding, Si wafers, CMM, welds, glass, quartz glass, silica glass (medical ampoules), display glass, car windshields, PCBs, medical balloons, barrier films, PET films, coatings, films, multilayer films, applied films, conformal coatings, electrode layer coatings, stent coatings, polyimide, PVB, resin materials, flux, adhesives, insulating films, air layers, dicing grooves, flip chips, wire bonders, microbumps, transparent, transparent bodies, black, glossy, mirror finish, easy.
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