High-precision non-contact thickness measurement device [for semiconductor wafers]
Achieves high-resolution shape measurement. A wide variety of sensor probes are available. Inline measurement of flatness and thickness is also possible. Suitable for wafer inspection applications.
Our company handles non-contact type measuring instruments based on the principles of chromatic aberration confocal and interference. These instruments can be applied to film thickness measurement, shape measurement, roughness measurement, displacement measurement, and appearance inspection, allowing for in-process measurement during manufacturing, high-speed inline inspection, and offline measurement. We offer various interfaces to accommodate embedded applications. Measurements can be performed with high resolution (minimum XY resolution of 1μm and minimum Z resolution of 0.02μm), contributing to improved product quality and reductions in manufacturing process time and costs. 【Features】 ■ Wide range of sensor lineup Sensors can be selected according to inspection requirements and materials from various sensor probes. ■ Sensors according to measurement range Available in single-point sensors, line sensor types, and area scan types. ■ Applications Can be utilized for inspection of PCB flex, wire loop inspection, wafer bump inspection, and more. *For more details, please refer to the materials. Feel free to contact us with any inquiries.
basic information
【Examples of Use】 ■ Inspection of shape defects in fine structures (LED dots, ball grid arrays, connector appearance, chip/PCB flex warping) ■ Loop height inspection for wire bonding ■ Thickness measurement of thin and thick films (wafers, adhesives, coated films, resin coatings) *Thickness measurement from 2 to 10,500 μm is possible ■ Roughness measurement (wafer surfaces, metal surfaces) ■ Displacement measurement (trench depth, pattern height/width) *For more details, please refer to the materials. Feel free to contact us with any inquiries.
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[Keywords: Applications, Measurement Items, Benefits, etc.] Non-contact sensors, optical sensors, confocal, spectral interference method, thickness, thin films, thick films, height, shape, appearance, edges, slopes, measurement, inspection, high speed, 3D, line sensors, line scan, area scan, full surface, small, compact, inexpensive, high precision, inline, monitoring, in-situ, during processing, before and after processing, polishing, offline, standalone machines, tabletop machines, sampling, embedded, semiconductors, wafers, wafer bonding, Si wafers, Si, GaAs, InP, SiC, LiNbO3 (LN), LiTaO3 (LT), GaN, SiP, Al2O3 (sapphire), transparent, transparent bodies, black, glossy, mirror finish, easy.
