Introduction of Presitech, a non-contact sensor manufacturer.
A non-contact sensor manufacturer skilled in measurements using color aberration confocal methods and spectral interference methods. Strong in high-speed and high-precision thickness and shape measurements. Capable of handling various materials!
Presitech is a non-contact sensor manufacturer based in Germany. It specializes in high-speed and high-precision thickness measurement and shape measurement, and is used for measuring and inspecting wafer thickness, edge shape, height, and flatness. It offers a wide measurement range, tolerance angles, and can accommodate various materials, with line sensors and area scanners suitable for full surface measurement. There are many proven applications in semiconductor manufacturing equipment, and it is also used in LCD manufacturing equipment and inline inspection of films. Additionally, it is utilized as a sensor for desktop machines such as standalone units. **Applications** Thickness measurement before and after wafer processing (such as polishing), during processing, film and coating thickness measurement, glass wafer thickness inspection, wafer edge shape, TTV, flatness, wire bonding shape, micro bump shape, weld joint shape, PCB shape, non-contact distance sensors mounted on CMM, battery foil thickness, glass thickness, air gaps, etc. *For more details, please refer to the PDF document or feel free to contact us.*
basic information
**Principle** Our products can mainly be divided into two types based on their measurement principles. ■ Chromatic Aberration Confocal: Primarily used for surface shape measurement, with main applications including height measurement and surface 3D shape measurement. Utilizing the principle of chromatic aberration confocal, we achieve high-speed, high-precision measurements with a large depth of focus and our excellent optical design technology, allowing for high angular tolerance. ■ Spectral Interferometry: Mainly used for thickness measurement. It enables high-precision measurements at the sub-micron level, leveraging the strengths of spectral interferometry. High-speed measurements necessary for in-situ, monitoring, and inline applications are possible. **Product Lineup** ■ Single Point Sensor There are sensors for shape measurement and thickness measurement. There are also affordable types available for under 1 million yen. ■ Line Sensor Primarily used for shape measurement, it can perform full-area measurements in conjunction with a moving stage. ■ Area Scanner Sensor This type can perform area scans with a 2-axis galvanometer. There are also area scanners that do not require a moving stage and are unaffected by vibrations. They can be used for shape measurement and thickness measurement. *For more details, please refer to the PDF materials or feel free to contact us.*
Price range
Delivery Time
Applications/Examples of results
Wafer processing (such as polishing) before and after, thickness measurement during processing, film/l coating thickness measurement, glass wafer thickness inspection, wafer edge shape, TTV, flatness, wire bonding shape, micro bump shape, weld joint shape, PCB shape, non-contact distance sensor mounted on CMM, foil thickness for batteries, glass thickness, air gap, etc.
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