High-speed and high-precision thickness measurement and shape measurement! Precitech non-contact sensors.
A non-contact sensor manufacturer skilled in measurements using chromatic aberration confocal method and spectral interference method. Strong in high-speed and high-precision thickness and shape measurements. Capable of handling various materials!
Presitech is a German manufacturer of non-contact sensors. They develop and manufacture optical sensors using chromatic aberration confocal method and spectral interference method. They specialize in high-speed and high-precision thickness measurement and shape measurement, which are used for wafer thickness, edge shape, height measurement, and flatness measurement and inspection. They offer a wide measurement range, tolerance angles, and can accommodate various materials, including line sensors and area scanners suitable for full surface measurement. They have numerous achievements in being integrated into semiconductor manufacturing equipment and are also used in LCD manufacturing equipment and inline inspection of films. Additionally, they are utilized as embedded sensors for tabletop machines such as standalone units. **Applications** Thickness measurement before and after wafer processing (such as polishing), thickness measurement of films/l coatings, glass wafer thickness inspection, wafer edge shape, TTV, flatness, wire bonding shape, micro bump shape, weld joint shape, PCB shape, non-contact distance sensors mounted on CMM, thickness of foil for batteries, glass thickness, air gaps, etc. *For more details, please refer to the PDF materials or feel free to contact us.*
basic information
**Principle** Our products can mainly be divided into two types based on measurement principles. ■ Chromatic Aberration Confocal This is primarily used for surface shape measurement, with main applications including height measurement and surface 3D shape measurement. Utilizing the principle of chromatic aberration confocal, we achieve high-speed, high-precision measurements with a large depth of focus and our excellent optical design technology, allowing for high angular tolerance. ■ Spectral Interferometry This is mainly used for thickness measurement. It enables high-precision measurements in the sub-micron range, leveraging the strengths of spectral interferometry. High-speed measurements necessary for in-situ, monitoring, and inline applications are possible. **Product Lineup** - Single Point Sensor There are sensors for shape measurement and thickness measurement. There are also affordable types available for under 1 million yen. - Line Sensor Primarily used for shape measurement, it can perform full-area measurements in conjunction with a moving stage. - Area Scanner Sensor This type can perform area scans with a 2-axis galvanometer. There are also area scanners that do not require a moving stage and are unaffected by vibrations. They can be used for shape measurement and thickness measurement. *For more details, please refer to the PDF materials or feel free to contact us.*
Price range
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Applications/Examples of results
Wafer processing (such as polishing) before and after, thickness measurement during processing, film/l coating thickness measurement, glass wafer thickness inspection, wafer edge shape, TTV, flatness, wire bonding shape, micro bump shape, weld joint shape, PCB shape, non-contact distance sensor mounted on CMM, foil thickness for batteries, glass thickness, air gap, etc.
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