Optical Area Scanner Flying Spot Scanner 310

Capable of measuring the total thickness of 12-inch wafers. High-speed measurement without the influence of vibrations, without a scanning stage. Suitable for online, offline, and wafer inspection applications.

The Flying Spot Scanner 310 is an optical measuring device that can perform wide-area (up to φ310) scans using XY2-axis galvanometer mirrors. Since stage scanning is not required, there is no influence from vibrations of the stage. It can measure thickness, dimensional shapes, and inspect surface defects based on the principle of spectral interference. Additionally, due to the coaxial optical system for incident and reflected light, it is possible to obtain good results even on glossy surfaces. 【Features】 ■ Wide-area scan φ310mm ■ High resolution XY20um Beam spot diameter 40um, high Z resolution through spectral interference method ■ No XY stage required, no stage vibrations Area scanning using galvanometer mirrors ■ Reduced development costs and shortened development lead times Software development kit for device integration (DLL, etc.) available ■ Applications Thickness measurement of 12-inch wafer surfaces, thickness measurement of bonded wafers, void inspection *For more details, please refer to the documentation.