SEMI-compliant 12-inch wafer thickness and shape measurement system
12" wafer full inspection accelerated, can also be used for full inspection of wafers.
The TTV, Bow, and Warp measurements of the entire wafer can be performed. With a measurement speed of up to 70,000 points per second, it is possible to measure the entire surface in about 2 minutes with a pitch of 160 µm in the XY direction. This is a full system equipped with software compliant with SEMI standards. The sensors used can be selected from our spectral interference sensor 2IT DW series, allowing for high-precision measurements with a Z resolution of 1 nm or better. The high-speed measurement of the entire wafer is made possible by our area scanner FSS310, which is incorporated into the system.
basic information
■Overview - A system that integrates hardware (enclosure, optical thickness sensor, area scanner, electrical cabinet) and software (SEMI-compliant software). - High-speed measurement of up to 70kHz (measuring a 12" wafer in about 2 minutes at an XY pitch of 160um). - Z resolution of 1nm or more. ■Thickness Measurement Range The thickness measurement range varies depending on the optical sensor below. CHRocodile 2 IT DW 250: 15~1500um CHRocodile 2 IT DW 500: 26~2500um CHRocodile 2 IT DW 1000: 66~7200um *Thickness is the optical length. To convert to Si thickness, divide the above thickness by the refractive index of Si.
Price range
P7
Delivery Time
OTHER
Model number/Brand name
MIRA PRO
Applications/Examples of results
12' wafer inspection
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News about this product（2）
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Semicon Japan 2024
We will be exhibiting at Semicon Japan 2024, which will be held at Tokyo Big Sight from December 11 (Wednesday) to December 12 (Friday). If you are interested, please come to the venue. ■ Products to be exhibited 1. Spectral interference optical thickness sensor CHRocodile 2 DW/ 2IT 2. Area scanner for measuring the thickness and shape of 12" wafers - Flying Spot Scanner (FSS) 3. Chromatic aberration confocal optical line sensor CLS2.0 4. Chromatic aberration confocal line camera CVC 5. Chromatic aberration confocal optical single-point sensor CHRocodile Mini 6. Non-contact thickness measurement sensor for opaque materials Enovasnese 7. Sensor for detecting internal defects non-contactly - Field sensor
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The 1st Kyushu Semiconductor Industry Exhibition
We will be exhibiting at the Kyushu Semiconductor Industry Exhibition held at Marine Messe Fukuoka on September 25 (Wednesday) and September 26 (Thursday), 2024. If you are interested, please come to the venue. ■ Products to be exhibited - Spectral interference optical thickness sensor CHRocodile 2 DW/2IT - Chromatic aberration confocal optical line sensor CLS2.0 - Chromatic aberration confocal optical single-point sensor CHRocodile 2S, C, Mini *This time, there will be no actual display of the FSS for 12" wafer thickness mapping measurement, but if you need an explanation or would like to request a demo, please come to our booth.
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Presitech is a specialist in laser material processing and optical measurement technology. We are not just a supplier of systems and components, but a professional partner in ensuring a smooth processing process for our customers. We offer consultations from the foundational stage and accurately consult with customers on their requests and objectives. We understand that the key to success in unique processing processes lies in the four components of exhibition, monitoring, processing, and control. Only by doing so can we provide appropriate solutions for our customers' applications. Our high-quality products, such as laser processing heads, quality monitoring systems, and optical measurement systems for spacing/thickness measurement, allow customers to directly benefit from our decades of experience. Our optical sensors are characterized by the highest precision and dynamic adaptability. Furthermore, they detect accurate values even in high-speed measurements.