ピュアオンジャパン Official site

Diamond Slurry "SPW": Standard Water-Based Slurry

Water-based slurry formulated according to customer requirements such as diamond type, particle size, and concentration. Please use it to build the optimal polishing process!

The "Type SPW" is a water-based diamond slurry suitable for use with metal lap discs and polishing pads. It is a water-based type that simplifies handling and cleaning, achieving a high polishing rate without compromising surface finishing. The high-dispersion formulation prevents the agglomeration of diamond particles, enhancing process stability. (Non-dispersed types are also available.) 【Features】 ■ Water-based type that simplifies handling and cleaning ■ Achieves a high polishing rate without compromising surface finishing ■ High-dispersion formulation that prevents the agglomeration of diamond particles (Non-dispersed options are available) ■ High reproducibility of processes *For more details, please refer to the PDF document or feel free to contact us.

Related Link - https://www.microdiamant.com/ja//diamond-slurries/

basic information

For more details, please refer to the PDF document or feel free to contact us.

Price range

Delivery Time

Model number/Brand name

SPW

Applications/Examples of results

For more details, please refer to the PDF document or feel free to contact us.

[SPW] Diamond Slurry_Water-Based

PRODUCT

[OPW] Diamond Slurry_Water-based_For Optical Components

PRODUCT

Recommended products

Distributors

Microdiamant, which has contributed to customers through precision classification, has acquired the American CMP-related company Eminess Technology and has become Pureon. In addition to our high-quality diamond-related products, we will also accumulate in-house know-how regarding final finishing CMP. What is important for our customers is the final finish. Even now, we receive inquiries about our diamond polishing because customers want to shorten the CMP process time. In the future, we will comprehensively handle consultations from grinding and polishing to CMP.