NOVA Corporation Automatic Analysis Device for Plating Solutions for Semiconductors and Printed Circuit Boards
Numerous adoption results worldwide. We propose suitable solutions for automatic plating solution analysis in various electroplating and electroless plating processes, as well as in the Cu damascene process.
We handle the "Automatic Analysis System for Semiconductor Plating Solutions" manufactured by NOVA, which is used by major semiconductor and electronic component manufacturers. *In 2023, NOVA, a measurement equipment manufacturer for semiconductors in Israel, acquired Ancosys and integrated it into the CMD division (Chemical Measurement Division). We offer the following lineup of automatic analysis systems for plating solutions in each process. Post-process, Advanced Packaging - Nova ANCOLYZER The Nova ANCOLYZER is the industry-standard fully automated online chemical measurement platform for advanced packaging processes. The Nova ANCOLYZER provides excellent analytical performance and supports various analytical techniques for process control. This platform can be configured to meet specific process analysis and replenishment requirements, designed with the most flexible and scalable structure. The Nova ANCOLYZER offers outstanding accuracy and precision, as well as uncompromising reliability and high availability. Basic information follows.
basic information
Damascene Copper Plating - Nova ANCOSCENE ANCOSCENE is a measurement system for wiring applications in damascene copper plating. This device is used in the manufacturing process of advanced nodes and is adopted by major manufacturers worldwide. ANCOSCENE provides fully automated analysis of plating bath components, warnings during the process, and process control. With automatic verification and calibration, ANCOSCENE performs fast and flexible analysis. In the analysis, there is no need for specific and expensive calibration solutions or chemicals, allowing for smooth operation. Copper Printed Circuit Boards, IC Substrates - Nova ANCOFLEX ANCOFLEX is a fully automated inline measurement system for the manufacturing process of copper printed circuit boards and IC substrates. ANCOFLEX provides monitoring of the composition and performance of the plating bath through lifetime monitoring. This platform combines reporting capabilities, controlled precision, and accuracy with uncompromising reliability and high availability. It features user-friendly maintenance and is supported domestically by our company, Kanematsu PWS. *For more details, please contact us.*
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Model number/Brand name
NOVA
Applications/Examples of results
We have numerous implementation achievements in semiconductor mass production factories (memory, logic, power devices, various sensors, etc.) in Europe, North America, Southeast Asia, Taiwan, South Korea, and China. Application examples: copper damascene plating, re-routing layers, copper pillars, silicon through-silicon vias (TSV) Plating solutions: Cu, Sn, SnAg, NiAu, Indium, Eless Ni, Eless Pd, Immersion Au We also have collaboration achievements with major plating equipment manufacturers. Please feel free to contact us regarding the achievements of various plating manufacturers and product names.
