Mipox Wafer Edge Polishing Equipment
Mipox WaferEdgePolisher boasts a track record of over 200 units delivered, primarily to SI wafer manufacturers and reclaimed wafer manufacturers.
Benefits of Tape Edge Polisher - Minimal damage to the wafer - Removal of films (e.g., SiO2) on the wafer edge is possible - Chemical-free processing - Easy utility connection - Capable of shaping various edge geometries - Both rough grinding and fine polishing are possible - Top edge polishing is possible - Can polish difficult materials such as SiC and GaN - Compatible with notches and orifices
basic information
STD(NME) type compatible with 6, 8, and 12 inches.
Price information
Please contact us.
Delivery Time
Applications/Examples of results
The Mipox Tape Edge Polisher is a wafer edge polishing device that uses polishing tape, boasting over 200 units delivered primarily to SI wafer manufacturers and reclaimed wafer manufacturers. Additionally, we accept contract processing for various semiconductor substrates ranging from 0.5-inch wafers to 12-inch wafers.
