Power semiconductor testing

The front-end testing of semiconductors is conducted in the wafer manufacturing process to verify whether the processing parameters meet design specifications after each step, or to check for defects that may affect yield. On the other hand, back-end testing equipment is performed after wafer processing is complete, primarily aimed at conducting electrical characteristic tests to confirm whether the chip's electrical performance meets specified values. Semight provides solutions such as wafer-level burn-in systems for SiC and handlers compatible with Known Good Die (KGD), delivering clear added value to customers in the form of improved testing efficiency and reduced testing costs.