Wafer-Level Burn-In for Various Devices and Components
Protect each circuit with complete hardware! Supports simultaneous burn-in of up to 20 wafers.
The "WLBI370A" can perform burn-in on devices such as Si, GaN, SiC, and ceramics using wafers, significantly improving the burn-in efficiency of the devices! It supports simultaneous burn-in of up to 20 wafers. Additionally, independent burn-in condition settings can be configured for each fixture. It fully protects each circuit with complete hardware. 【Features】 - Suitable for burn-in of wafers such as Si, GaN, SiC, and ceramics - Independent burn-in condition settings for each fixture - Capable of powering on all chips on a wafer simultaneously for burn-in - Voltage range customizable up to a maximum of 200V - Supports current monitoring during burn-in - Temperature range RT-200C Sold by layer (1 wafer is burned in with 1 layer of circuits), with the option for expansion, helping to reduce initial investment. *For more details, please refer to the PDF document or feel free to contact us.
basic information
For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
