Polycrystalline ultra-high thermal conductivity optical grade diamond substrate
Multi-crystal ultra-high thermal conductivity optical grade wafer/sheet
Laser, optoelectronic devices, high output heat dissipation, and other high-end applications.
basic information
Multicrystalline structure: Optimizes crystal alignment and improves material consistency. Thermal conductivity: Achieves excellent heat dissipation performance with a maximum of 1600 W/(m•K). Size range: Up to a diameter of 100 mm, meeting the needs of large-scale applications. Thickness: 0.5 mm to 2 mm. Optical transparency: Transmittance ≥ 90%. Low thermal expansion coefficient: < 1.0 × 10‑6 /K. Mechanical strength: > 80 GPa.
Price range
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Applications/Examples of results
Laser, optoelectronic devices, high output heat dissipation, and other high-end applications.
