Polycrystalline super high thermal conductivity diamond substrate
High-output electronics, laser cooling, heat dissipation management, etc.
Optimize the crystal arrangement to improve material consistency. Customization for metalization is possible.
basic information
Thermal conductivity: Maximum 1300 W/(m•K) Size range: Diameter 100mm Thickness options: 0.5mm to 3mm Low thermal expansion coefficient: < 1.0 × 10‑6 /K Mechanical strength: >70 GPa
Price range
Delivery Time
Applications/Examples of results
High-output electronics, laser cooling, heat dissipation management
