▶Fully Automated, Intelligent Integrated Solution A highly integrated fully automated test system that fully covers the complex chip inspection process.

▶ Loading Module This module consists of the following four sub-functional modules: - Chimple Z-axis Module - X/Y-axis Movement Module - Blue Film Rotation Module - Pickup Function Unit This automates a series of processes for high-precision adsorption and transfer of chips on a wafer or an extension ring.

▶High Temperature and Normal Temperature Test Module This module is a high-precision test unit compatible with two temperature ranges, consisting of the following components: - Hollow-type rotating platform (supports wafer flipping and transport switching) - Two 3-axis chip alignment modules positioned at the front and back - 3-axis optical detection module (PD and collimator optical system) - ID and position recognition camera installed on the top - Power-on Probe module: Executes position and angle correction after transport, allowing for accurate power-on and measurement of the chip The PD (photodiode) and collimator can be switched at high speed using independent drive axes, supporting automatic switching of functions according to the measurement mode.

▶Camera & Power Probe Module This module is composed as a composite unit for chip position recognition, ID identification, and power measurement. 【Camera System Configuration】 - Loading Camera (right side of the device): It performs chip recognition and seating determination during chip transport. It can flexibly collaborate with different functional modules depending on the incoming form. - High-Temperature/Room Temperature Test Module Upper Camera (central part of the device): After chip transport, it captures images from multiple angles using a 3-axis movement module, performing high-precision alignment correction of the chip position. In the high-temperature zone, ID recognition is also executed simultaneously. 【Probe Power Module】 - Each test platform can accommodate up to three sets of power probes. - A configuration with PD (Photodiode) + backlight can be added as an option. - Depending on the type of chip, LIV measurement, extinction ratio measurement, etc., can be flexibly configured. This module provides an environment for one-touch continuous measurement of optical parameters for DFB/EML products, achieving improved yield and process efficiency in mass production sites.

▶ Blanking Binning Module This module has four tray installation areas and is compatible with 4-inch and 6-inch blue tape. Additionally, customization of the corresponding unloading carrier is possible according to customer requests.