Vacuum soldering device (vacuum reflow device)

Exhibiting at Internepcon! Introducing new products that accommodate large-scale products. <Sample testing now available>

The vacuum soldering device removes voids in the solder by melting the solder in a vacuum. By performing preheating in a hydrogen atmosphere or formic acid atmosphere, it achieves flux-free soldering. It boasts the number one domestic track record as a standard machine in the power device manufacturing process. With the adoption of an upper lamp heater specification, it can accommodate large products and irregular substrates, including heavy items. [Exhibition Information] We will exhibit at Internepcon 2023. A panel of this device and samples of large products will be displayed. (Exhibition dates: January 25 (Wed) to January 27 (Fri) at Tokyo Big Sight, Booth Number: East Hall 1, 2-34) *For detailed specifications, please download the PDF. Feel free to contact us.

basic information

【Features】 1. Reflow is possible in N2, H2, and formic acid atmospheres. 2. High-quality soldering achieved through concentration control of H2 and formic acid. 3. Low oxygen concentration (below 5ppm). 4. Supports not only rapid heating and rapid cooling but also step heating and slow cooling. 5. A wide range of options available from batch to medium and large-scale production. 【Main Specifications】 Processing dimensions: W310×D320×H150mm (batch type) Processing temperature: 100℃ to 450℃, MAX 500℃ Atmosphere: N2, H2, formic acid, or vacuum Vacuum system: Achievable pressure of 1Pa ◎ For more detailed information, please refer to the catalog or contact our sales office directly.