Shinwa Co., Ltd. Mechatronics System Center Official site

Video Release: Dispensing of Lens Molds for LEDs

Application of LED lens mold using a dispenser. Developed a new method! Successful cost reduction due to mold-less production!

- LED post-process / substrate mounting process → Adjustment of application amount based on screw rotation (Compatible with high-viscosity materials) → Reduction in the number of equipment investments through high-speed dispensing (Compared to air dispensers: 3 to 8 times processing capacity) → Increased stability of application amount through room temperature discharge! → Significant reduction in yield loss, increased production efficiency!

basic information

【Features】 ◆ Adjustment of application amount by screw rotation!   (Application amount stability ◎) ◆ Achieves room temperature dispensing of high viscosity materials!  → By adopting a screw method, it is possible to discharge high viscosity materials.   (MAX: 500,000 mPa.s can be dispensed at room temperature) ◆ Realizes high-speed dispensing ◆ Adopts a one-touch replacement method, successfully reducing replacement time significantly! ◆ Compatibility with line coating (acceleration/deceleration, coating adjustment function for corners) ◆ Achieves low running costs ◆ Simple software program We offer free sample testing for those considering a purchase. For details, please request materials or refer to the catalog.

Price information

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Delivery Time

Model number/Brand name

Quspa-Screw

Applications/Examples of results

【Application】 ◆BGA Underfill ◆LED Phosphor General (SMD/Side View/Dam & Fill, etc.) ◆Solder Paste (φ200μm~φ250μm)   ※The application diameter is affected by the solder particles used. ◆Ag Paste                             Others

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