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Microfabrication technology! Applying techniques such as electroplating, silicon etching, and glass etching to the development of various advanced technologies!

Photofabrication is also known as Photo Etching, Photo Chemical Machining, and Photo Chemical Milling. Photofabrication involves two main methods: the first is the Photo Etching method, which forms an image on the surface of the material using photoresist through photographic techniques, and then chemically or electrochemically removes (etches) the areas not covered by the photoresist to manufacture the product. The second is the Photo Forming method (electroforming), where metal is deposited on the areas without photoresist (electroplating), and that deposited metal itself becomes the product. Additionally, in recent years, the Sandblasting method, which uses abrasive materials instead of etching solutions to manufacture products, has also become known.

A bump with a minimum diameter of Φ20µm is formed at the terminal section of the FPC. The bump is used as a contact point and is applied in high-precision circuit testing, etc. (Flexible substrate)

Flexible printed circuit board Flexible substrate

Ultra-fine processing at the micron level is possible! It is widely applied in fields such as electronic components and semiconductors.

【Cross-sectional Shape】 ■Overhang Type - Products are deposited to overlap with the photoresist. ■Straight Type - A linear shape in the thickness direction. ■Stacked Type - Composed of multiple layers. *Please contact us if you need a detailed explanation.

[Basic Knowledge] The standard manufacturing process of Taiyo Industry, which has focused on small quantities of a wide variety of products, has been documented!

【Other Listings】 ■Development ■Etching ■Peeling ■Intermediate Inspection (AOI) ■Coverlay Processing ■Coverlay Temporary Bonding ■Coverlay Heat Press ■Printing (Silk) ■Surface Treatment (NiAu Plating) ■Sheet Bonding Processing (Reinforcement Plate) ■Reinforcement Plate Heat Press / Heat Roller ■Outline Processing (Mold) ■Outline Processing (Thomson Die) ■Final Inspection ■FPC Completion ■Component Mounting *For more details, please refer to the PDF document or feel free to contact us.

Ultra-fine lines, high density, and high-resolution flexible printed circuit boards have made it possible to form ultra-fine circuits through the integration of MSAP technology and via filling techniques!

MSAP (Modified Semi Additive Process) method Via filling: Filling through-hole holes with copper plating

Surface treatment using plating to prevent light reflection, enabling ultra-fine processing at the micron level! It is widely applied in fields such as electronic components and semiconductors.

【Cross-sectional Shape】 ■Overhang Type - Products are deposited to overlap with the photoresist. ■Straight Type - A shape that is linear in the thickness direction. ■Layered Type - Composed of multiple layers. *Please contact us if you need a detailed explanation.