Bump FPC
A bump with a minimum diameter of Φ20µm is formed at the terminal section of the FPC. The bump is used as a contact point and is applied in high-precision circuit testing, etc. (Flexible substrate)
The bump FPC is a bump generation technology that our company specializes in, applied to the FPC. It is optimal for testing fine-pitch insertion terminals and display lighting tests when combined with our contact clips and hand presses. *For more details, please refer to the PDF document or feel free to contact us. #Flexible #FPC #FlexibleCircuitBoard #FlexiblePrintedCircuitBoard #CircuitBoard #PrintedCircuitBoard #Special #Bump #ShortLeadTime #MassProduction
basic information
Flexible printed circuit board Flexible substrate
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Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
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【TTL】Microfabrication technology! Applying techniques such as electroplating, silicon etching, and glass etching to the development of various advanced technologies!
Microfabrication technology (photofabrication) plays an important role as a production technology, producing precision machined components such as lead frames, HDD suspensions, encoders, TAB tapes, various filters, and decorative items. Additionally, based on photofabrication technology, current advanced technologies such as printed circuit boards, photomasks for LSI, color filters for color liquid crystal display devices, and semiconductors are also being developed. [Source: Photofabrication Association - Technical Explanation]
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[TAIYO] For flexible circuit boards and quick procurement, contact Taiyo Industry! We can assist you with high-frequency compatible, mass production, special circuit boards, and more!
Taiyo Industry responds to urgent requests for flexible printed circuit board procurement. Even without CAD data provided, we can handle everything from data creation! We can offer one-stop solutions for high-frequency compatibility, special specifications, and assembly. For urgent flexible printed wiring boards, trust Taiyo Industry! *Delivery times vary depending on the type and specifications of the FPC.
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Taiyo TechnoRex Co., Ltd. continues to operate in the fields of prototype development of flexible printed circuit boards (FPC) and printed circuit board testing systems. Since FPC is fundamentally related to the structure of hardware, both high precision quality and shortened development time are required. We have extensive experience and know-how in the manufacturing processes of single-sided FPC, double-sided FPC, multilayer FPC, and their advanced types, and we continuously improve and enhance our technology, resulting in consistent evaluations of our delivery times and quality. Additionally, while technically advancing further miniaturization and high density, we are also undertaking new initiatives such as bump-type and special material electroplating. On the other hand, our printed circuit board testing systems mainly consist of electrical inspection systems and final appearance inspection systems, which are adopted in the mass production sites of FPCs and package/module-type substrates. They operate day and night in quality control settings for substrates used in smartphones, automotive applications, and various electronic devices. We will continue to respond to the increasingly diverse market needs. *On December 21, 2023, the company name was changed from "Taiyo Kogyo Co., Ltd." to "Taiyo TechnoRex Co., Ltd."*