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It is a board inspection device capable of ultra-fast in-circuit testing at a top-class level in the industry.

To ensure that electronic devices function correctly, the electronic circuit board within the device must operate normally. The electronic circuit board becomes operational when electronic components are correctly mounted on the printed circuit board (PCB) and power is supplied. The process of contacting a specialized probe to the electronic circuit board, which has electronic components mounted on it, and applying a minute electrical signal for testing is called In-Circuit Testing (ICT), and the device used for this testing is referred to as an In-Circuit Tester. This method allows for the inspection of "connection reliability between electronic components and the board," "the values of individual mounted electronic components (such as resistors and capacitors)," and "diode polarity," without imposing unnecessary loads on the board itself. It is also known as MDA (Manufacturing Defect Analyzer). Main inspection contents: ● Solder shorts and opens ● Pattern disconnections ● Missing components ● Incorrect component values ● Reverse insertion of polarized components ● Lifted leads of ICs and connectors ● Operation confirmation of digital transistors, optocouplers, and Zener diodes ● Other simple function tests

It is a board inspection device capable of ultra-fast in-circuit testing at a top-class industry level. (Supported board size for inspection: up to 985×610)

To ensure that electronic devices function correctly, the electronic circuit board within the device must operate normally. The electronic circuit board becomes operational when electronic components are correctly mounted on the printed circuit board (PCB) and power is supplied. The process of contacting a dedicated probe to the electronic circuit board, which has electronic components mounted on it, and applying minute electrical signals for testing is called In-Circuit Testing (ICT), and the device used for this testing is referred to as an In-Circuit Tester. This testing checks the "connection reliability between electronic components and the board," the "values of individual mounted electronic components (such as resistors and capacitors)," and the "polarity of diodes," all without imposing unnecessary loads on the board itself. It is also known as MDA (Manufacturing Defect Analyzer). Main inspection contents: ● Solder shorts and opens ● Pattern disconnections ● Missing components ● Incorrect component values ● Reverse insertion of polarized components ● Lifted leads of ICs and connectors ● Operation verification of digital transistors, optocouplers, and Zener diodes ● Other simple function tests

This is a flagship model that arranges probe heads on both the top and bottom, enabling simultaneous in-circuit testing of the front and back of the substrate.

To ensure that electronic devices function correctly, the electronic circuit board within the device must operate normally. The electronic circuit board becomes operational when electronic components are correctly mounted on the printed circuit board (PCB) and power is supplied. The process of contacting a dedicated probe to the electronic circuit board, which has electronic components mounted, and applying minute electrical signals for testing is called In-Circuit Testing (ICT), and the device used for this testing is referred to as an In-Circuit Tester. This method allows for the inspection of "connection reliability between electronic components and the board," "the values of individual mounted electronic components (such as resistors and capacitors)," and "diode polarity," without imposing unnecessary loads on the board itself. It is also known as MDA (Manufacturing Defect Analyzer). Main inspection items include: - Solder shorts and opens - Pattern disconnections - Missing components - Incorrect component values - Reverse insertion of polarized components - Lifted leads of ICs and connectors - Operation confirmation of digital transistors, optocouplers, and Zener diodes - Other simple function tests.

The probe head is arranged above and below, allowing for simultaneous in-circuit testing of both sides of the substrate. (Supported substrate size for inspection: up to 985×610)

To ensure that electronic devices function correctly, the electronic circuit board within the device must operate normally. The electronic circuit board becomes operational when electronic components are correctly mounted on the printed circuit board (substrate) and power is supplied. The process of contacting a specialized probe to the electronic circuit board, which has electronic components mounted on it, and applying minute electrical signals for testing is called In-Circuit Testing (ICT), and the device used for this testing is referred to as an In-Circuit Tester. This testing checks the "connection reliability between electronic components and the substrate," "the values of individual mounted electronic components (such as resistors and capacitors)," and "the polarity of diodes," without applying unnecessary load to the substrate itself. It is also known as MDA (Manufacturing Defect Analyzer). Main inspection contents: - Solder shorts and opens - Pattern disconnections - Missing components - Incorrect component values - Reverse insertion of polarized components - Lifted leads of ICs and connectors - Operation confirmation of digital transistors, optocouplers, and Zener diodes - Other simple function tests

We have won the 20th "JPCA Award"!

Exhibition Name: JISSO PROTEC 2024 (25th JPCA Show Implementation Process Technology Exhibition) Dates: June 12 (Wednesday) to June 14 (Friday), 2024, 10:00 AM to 5:00 PM Venue: Tokyo Big Sight, East Exhibition Hall Exhibited Products: ■ Electronic component mounting machines and related equipment/systems: Mounting machines (mounters), insertion machines (inserters), cream solder printing machines, soldering equipment (reflow ovens), dispensers ■ Implementation-related equipment/systems: Transport systems, AGVs, automated warehouses, taping machines/materials, bulk feeders and other feeders, automatic assembly equipment, laser marking devices, cleaning equipment/cleaning agents ■ Semiconductor mounting machines/systems: Bonding equipment, flip chip mounting systems, COB systems ■ Industrial robots: Handling robots, assembly robots, transport robots, AMRs ■ Inspection/testing equipment: Substrate appearance inspection equipment, semiconductor manufacturing-related inspection/measurement equipment ■ Implementation design systems: Design tools, production optimization software, implementation programming devices ■ Implementation devices/components and related materials ■ Implementation bonding systems/solder/bonding materials ■ High-frequency compatible devices/components/materials

Thank you for visiting the Total Solutions Exhibition for Electronic Devices 2024 / JISSO PROTEC 2024.

Exhibition Name: JISSO PROTEC 2024 (25th Assembly Process Technology Exhibition) Dates: June 12 (Wednesday) to June 14 (Friday), 2024, 10:00 AM to 5:00 PM Venue: Tokyo Big Sight, East Exhibition Hall Exhibited Products: ■ Electronic component mounting machines and related equipment/systems: Component placement machines (mounts), component insertion machines (inserters), cream solder printers, soldering equipment (reflow ovens), dispensers ■ Assembly-related equipment/systems: Conveyance systems, AGVs, automated warehouses, taping machines/materials, bulk feeders and other feeders, automated assembly devices, laser marking devices, cleaning devices/cleaning agents ■ Semiconductor mounting machines/systems: Bonding equipment, flip chip mounting systems, COB systems ■ Industrial robots: Handling robots, assembly robots, transport robots, AMRs ■ Inspection/testing equipment: PCB appearance inspection equipment, semiconductor manufacturing-related inspection/measurement equipment ■ Assembly design systems: Design tools, production optimization software, assembly programming devices ■ Assembly devices/components and related materials ■ Assembly device packaging materials ■ Assembly joining systems/solder/joining materials ■ High-frequency compatible devices/components/materials