High-capacity RFID inlay bonder "ADAT3 XF Tagliner"
Achieving a processing capacity of 48,000 units per hour and 100% optical inspection. It robustly supports RFID inlay manufacturing, accommodating various web materials such as paper.
The high-capacity RFID inlay die bonder "ADAT3 XF Tagliner" is equipped with a high-speed production capability of 48,000 pieces per hour, performing 100% high-resolution optical inspection throughout all processes from adhesion to die attachment, connection, and curing without compromising speed. It accommodates not only transparent materials but also opaque web materials such as paper, contributing to sustainable substrate selection. The automatic wafer exchange function eliminates manual work, supporting high productivity and quality control. 【Features】 ■ High-speed processing of 48,000 pieces per hour and support for flip chip bonding ■ Flexible design accommodating various web materials such as paper and transparent films ■ 100% high-resolution optical inspection throughout the entire processes of adhesion, connection, and curing *For more details, please download the PDF or feel free to contact us.
basic information
For more details, please download the PDF or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
For more details, please download the PDF or feel free to contact us.
catalog（3）
Download All Catalogs
Recommended products
Distributors
Our company handles semiconductor manufacturing equipment, food-related equipment, automotive-related equipment, high-security equipment, terahertz equipment, and plant-related equipment. We continue to contribute to the creation of a healthy and safe society by importing things that did not exist in the world or things that we thought would be nice to have from excellent suppliers around the globe.