半導体製造装置
半導体製造装置
進化し続ける半導体製造における最先端技術・装置を提案いたします
1～9 item / All 9 items
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Super High-Speed Die Bonder "ADAT3 XF Series"
Achieves a processing capacity of 72K UPH and high-precision bonding. Supports flip chips and various processes, contributing to improved productivity in semiconductor manufacturing.
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High-Precision Bonding System 'ADAT3 XF DBSG'
A method to triple production capacity without expanding the clean room!
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High-capacity RFID inlay bonder "ADAT3 XF Tagliner"
Achieving a processing capacity of 48,000 units per hour and 100% optical inspection. It robustly supports RFID inlay manufacturing, accommodating various web materials such as paper.
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Chip-to-Wafer System "C2W"
Achieving high-speed processing of over 40,000 units per hour and high precision of less than 5μm. Supports multi-faceted assembly such as face-up and flip chip.
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Non-contact surface measurement system "CT350"
Achieves high-resolution 3D optical measurement within a maximum range of 350×350mm². Supports extensive surface analysis with six types of sensor technologies.
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Dual-Surface Thickness Measurement System 'CT600ST'
Equipped with two chromatic confocal line sensors. Achieves high-speed and high-precision dual-side thickness analysis at 2×384,000 data points per second.
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WLCSP die sorter "ADAT3 XF DS"
Processing capacity of 60,000 units per hour. Contributes to quality assurance and productivity improvement by performing six-sided inspections of dies without reducing speed.
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Plating equipment for lead frames
Reduction of precious metal loss and automatic quality control. Advanced plating technology from Germany and AI inspection achieve both reduced manufacturing costs and high quality standards.
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Plating equipment for lead frames for semiconductor manufacturing
Reduction of precious metal loss and automatic quality control. Cost reduction and quality improvement through German technology and AI inspection.
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