High-speed inline strip-to-strip die bonder
ADAT3 XF DBS enhances productivity! A die bonder that supports on-the-fly quality inspection.
The "ADAT3 XF DBS" is an inline strip-to-strip die bonder that directly receives strips from a single machine, processes them, and sends them to the next machine to enhance productivity. It handles ultra-small and medium-sized dies and can be easily connected to upper and lower screen printing equipment. It is also equipped with a high-resolution optical system that allows for quality inspection on the fly. 【Features】 - Equipped with automatic wafer exchange and high-resolution optical system - Capable of quality inspection on the fly - Achieves high throughput for mass production - Supports belt-in and belt-out *For more details, please download the PDF or feel free to contact us.
basic information
【Specifications】 ■Performance: 60,000 units per hour ■Supports wafer frames for 8 to 12-inch frame film carriers ■Strip size: 100 x 300 mm ■Solder paste/adhesive ■Die size: 0.2 x 0.2 mm to 7 x 9 mm *For more details, please download the PDF or feel free to contact us.
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Applications/Examples of results
【Applications and Examples】 ■ Solder Paste Power Applications ■ SO8 ■ DPAK ■ SOD123/128 ■ SOT669 *For more details, please download the PDF or feel free to contact us.
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Our company handles semiconductor manufacturing equipment, food-related equipment, automotive-related equipment, high-security equipment, terahertz equipment, and plant-related equipment. We continue to contribute to the creation of a healthy and safe society by importing things that did not exist in the world or things that we thought would be nice to have from excellent suppliers around the globe.