All products and services
1～24 item / All 24 items
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High-Precision Bonding System 'ADAT3 XF DBSG'
A method to triple production capacity without expanding the clean room!
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Super High-Speed Die Bonder "ADAT3 XF Series"
Achieves a processing capacity of 72K UPH and high-precision bonding. Supports flip chips and various processes, contributing to improved productivity in semiconductor manufacturing.
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Chip-to-Wafer System "C2W"
Achieving high-speed processing of over 40,000 units per hour and high precision of less than 5μm. Supports multi-faceted assembly such as face-up and flip chip.
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High-capacity RFID inlay bonder "ADAT3 XF Tagliner"
Achieving a processing capacity of 48,000 units per hour and 100% optical inspection. It robustly supports RFID inlay manufacturing, accommodating various web materials such as paper.
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WLCSP die sorter "ADAT3 XF DS"
Processing capacity of 60,000 units per hour. Contributes to quality assurance and productivity improvement by performing six-sided inspections of dies without reducing speed.
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Dual-Surface Thickness Measurement System 'CT600ST'
Equipped with two chromatic confocal line sensors. Achieves high-speed and high-precision dual-side thickness analysis at 2×384,000 data points per second.
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Non-contact surface measurement system "CT350"
Achieves high-resolution 3D optical measurement within a maximum range of 350×350mm². Supports extensive surface analysis with six types of sensor technologies.
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Non-contact multilayer film thickness inspection system
All you need is one scan! Terahertz pulses instantly determine the boundaries of each layer's material.
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Plating equipment for lead frames for semiconductor manufacturing
Reduction of precious metal loss and automatic quality control. Cost reduction and quality improvement through German technology and AI inspection.
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Plating equipment for lead frames
Reduction of precious metal loss and automatic quality control. Advanced plating technology from Germany and AI inspection achieve both reduced manufacturing costs and high quality standards.
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Non-contact terahertz coating thickness measurement system 'Irys'
Simultaneous measurement of the thickness of multi-layer coatings in a non-contact and non-destructive manner. It contributes to paint quality management and material savings in conjunction with monitoring software.
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Sintering Press Device "X-SINTER P200X Series"
High-reliability joining technology for power electronics components! We will send a video of the equipment to those who are interested!
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High Vacuum Capper
A new packaging technology that will revolutionize food preservation! It enables the long shelf life of glass jar products.
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High-pressure homogenizer / high-pressure pump │ BOS Corporation
Reduce and homogenize particles to submicron size. Operate with less water and electricity, supporting the long-term operation of production processes and equipment in various industries.
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Cook chill system
Introducing a system that allows for mass production 45 days in advance while preserving flavor, texture, and aroma.
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Bone extraction and soup production line | COCTIO Corporation
Extracting high-value soups and sauces from unused animal bones. Achieving hygienic clean label product industrial production with a sealed automatic system.
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Soup and Sauce Automatic Manufacturing Device 'COCTIO AiOS 4300'
Manufacturing additive-free cooking bone broth! Providing an automated turnkey processing line.
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Identity Verification and ID Authentication Solutions | Regula
Accurately verify identities with over 16,500 document databases and facial biometric authentication. Reduces manual checks and supports fraud prevention.
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Document and banknote counterfeit detection device 'Regula 4308M'
Precision verification of documents and banknotes with an upper and lower two-line optical system and dual filters. Achieves accurate authenticity verification in seconds with ultra-high-resolution images.
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Pulse Power Supply for Bio Research 'EPULSUS-FBML1-5'
Voltage 5kV, adopting SiC technology. Supports advanced biomedical research with two independent channels and a fast rise time of less than 50ns.
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Multi-electrode 4CH pulse generator 'EPULSUS-FPM4-10'
10kV voltage with 4-channel independent control. Supports complex experiments with bipolar asymmetric operation and precise timer control.
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Industrial Pulse Generator 'EPULSUS-BM3B-24'
Supports a voltage of 24kV and a peak current of 500A. Contributes to the expansion of processing capacity in high-throughput production lines and the improvement of on-site strength.
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Industrial Pulse Generator 'EPULSUS-BM3B-12'
Supports a voltage of 12kV and a peak current of 500A. It is an industrial model with an output of 9kW that supports continuous production lines.
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Research PEF system 'EPULSUS-BM1A-12'
Supports voltage of 12kV and output of over 3kW. Comes with batch and continuous processing chambers, suitable for applications from laboratory to pilot research.
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