WLCSP die sorter "ADAT3 XF DS"
Processing capacity of 60,000 units per hour. Contributes to quality assurance and productivity improvement by performing six-sided inspections of dies without reducing speed.
The die sorter "ADAT3 XF DS" for wafer-level CSP and micro CSP has a processing capacity of 60,000 units per hour and accommodates die sizes from 0.2×0.4mm to 5×5mm. It features the ability to automatically inspect all six sides of the die without reducing processing speed, contributing to quality control and cost reduction in subsequent processes. It supports automation in semiconductor manufacturing with programmable low-pressure pick force and automatic wafer exchange capabilities. 【Features】 - Achieves both a processing speed of 60,000 units per hour and automatic inspection of all six sides - Accommodates die sizes from 0.2×0.4mm to 5×5mm - Contributes to automation with support for 8 to 12-inch wafers and automatic exchange functionality *For more details, please download the PDF or feel free to contact us.
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Our company handles semiconductor manufacturing equipment, food-related equipment, automotive-related equipment, high-security equipment, terahertz equipment, and plant-related equipment. We continue to contribute to the creation of a healthy and safe society by importing things that did not exist in the world or things that we thought would be nice to have from excellent suppliers around the globe.