Chip-to-Wafer System "C2W"
Achieving high-speed processing of over 40,000 units per hour and high precision of less than 5μm. Supports multi-faceted assembly such as face-up and flip chip.
The Chip-to-Wafer assembly system 'C2W' for semiconductor assembly achieves high-speed operation with a pick-and-place speed exceeding 40,000 UPH and high-precision positioning of less than 5μm (3 Sigma). It supports die sizes from 0.2 to 10mm and allows for switching between face-up, face-down (flip chip), and embedded chip configurations within the system. It meets diverse micro-assembly requirements and contributes to improving productivity in semiconductor manufacturing and reducing TCOO. 【Features】 ■ High-speed pick-and-place exceeding 40,000 units per hour and high precision of less than 5μm ■ Supports switching between face-up and face-down configurations within the system ■ Compatible with die sizes from 0.2 to 10mm and panels up to 330×330mm *For more details, please download the PDF or feel free to contact us.
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Our company handles semiconductor manufacturing equipment, food-related equipment, automotive-related equipment, high-security equipment, terahertz equipment, and plant-related equipment. We continue to contribute to the creation of a healthy and safe society by importing things that did not exist in the world or things that we thought would be nice to have from excellent suppliers around the globe.