Our company will participate in the "Solder and Fine Joining Subcommittee Symposium - Research and Development Trends in Implementation Technologies and Materials Supporting the DX and GX Era" held by the Japan Welding Society. At this symposium, there will be presentations on the research and development trends of semiconductor devices that support the DX and GX era, as well as the implementation technologies and materials used in them. The Chief Engineer from Zestron Japan Co., Ltd. is scheduled to speak. Additionally, we will introduce new technologies and products, as well as our efforts in the standardization activities of the related cleaning evaluation working group. We hope you will join us.