Our engineers have written about the cleaning technology required for sintering joining devices.
ゼストロンジャパン
In the publication "Development of High-Heat-Resistant and High-Thermal-Conductive Materials for Next-Generation Power Devices - Thermal Management: Substrates, Joining, Sealing, and Cooling Technologies" by the Technical Information Association, our engineer has written about "Cleaning Techniques Required for Sintered Joining Devices." The text explains topics such as "The Formation and Residual Effects of Contamination in Sintered Joining Devices," "Selection of Cleaning Agents and Cleaning Methods," and "Analysis of Cleanliness After Cleaning." The book also provides a thorough explanation of Si, SiC, GaN, and gallium oxide, as well as the required characteristics in automotive environments and implementation examples. It details guidelines for designing TIMs and thermal sheets that balance "thermal characteristics" and "operational reliability." We highly recommend reading it.
Related Links