Added a page on 'Case Study: Flux Cleaning Issues Due to High-Density Component Mounting.'

ゼストロンジャパン
We would like to introduce a case study on the investigation of factors leading to cleaning defects in flux cleaning troubles caused by the high density of component mounting. With the increase in component mounting density, a change in the solder paste used was made, but there have been reports of defects believed to be caused by cleaning issues. Based on the information gathered, we inferred the current situation. We conducted an analysis and evaluation of the hypothesis, and based on the results, we proposed both temporary and permanent measures tailored to the customer's circumstances.
