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ADLINK releases a new panel PC "SP2-MTL" compatible with Intel Core Ultra and NVIDIA GPU for edge AI applications.
● AI-enabled high performance: Equipped with an integrated NPU and optionally compatible with NVIDIA GPUs, enabling scalable edge AI workloads. ● Modular I/O and flexible scalability: Supports functi…
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ADLINK releases a ROS 2 robotics controller adopting the NVIDIA Jetson platform for edge AI applications.
ADLINK Technology has announced the ROScube-X series of real-time ROS 2 robot controllers for advanced robotics applications. The ROScube-X series from ADLINK features the NVIDIA Jetson AGX Xavier module, which includes a variety of interfaces such as an integrated Volta GPU, dual deep learning accelerators, and a GMSL2 camera connector that can integrate cutting-edge robotics systems. It is also compatible with the fully equipped resources provided by the NVIDIA JetPack SDK, making it ideal for robotics applications that require advanced AI computing performance with minimal power consumption.
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ADLINK releases the ROScube-I ROS 2 controller for edge AI robotics in collaboration with Intel.
The ADLINK ROScube-I series is a ROS 2-compatible robot controller that features Intel Xeon E, 9th generation Intel Core i7/i3, and 8th generation Intel Core i5 processors. It is equipped with advanced I/O connectivity that supports a wide range of sensors and actuators, catering to the diverse needs of robotic applications. The ROScube-I also supports an expansion box that includes the "Intel Distribution of OpenVINO" toolkit, which is useful for enhancing functionality and performance, along with an Intel VPU card for computing AI algorithms and interfaces. Robot systems based on the ROScube-I are supported by ADLINK's Neuron SDK, a platform specifically designed for specialized robotic applications such as autonomous mobile robots (AMR).
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ADLINK accelerates the adoption of edge AI and computing with next-generation Matrix embedded computers.
ADLINK Technology today announced the release of the next-generation Matrix embedded computer, designed to enhance the responsiveness and durability of edge AI and computing applications. The next-generation Matrix series, engineered to boost performance, offers innovation and robustness to enable data-driven decision-making at the edge, achieving improvements in efficiency, productivity, and security across the industry. The next-generation Matrix series elevates system responsiveness to the next level with its heterogeneous computing architecture. The new Matrix series combines CPU computing based on the 9th generation Intel Xeon and Core processors with GPU computing from the NVIDIA Quadro Embedded GPU, accelerating compute-intensive high-resolution medical imaging and enabling faster and more accurate diagnoses.
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COM-HPC: Latest PICMG Computer-on-Module for High-Performance Edge Computing
PICMG (PCI Industrial Computer Manufacturers Group) is in the final stages of developing the latest COM-HPC computer-on-module specification to meet the needs of the highly advanced industrial edge computing market. The COM-HPC specification is intended not to replace COM Express but to expand upon its success, with a release planned by the second quarter of 2020. Edge computing is a rapidly growing field that demands unprecedented levels of performance. The system memory requirements for current and future high-end embedded multicore processors are increasing very sharply. As memory requirements approach 128 GB or 256 GB, current common form factors like COM Express can no longer provide a cost-effective solution. This is why COM HPC is needed. Five sizes have been defined that can be used as server modules capable of accommodating up to eight DIMM sockets onboard.
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The newly released SMARC module specification revision 2.1 will be the first open AIoM (AI on Module) specification.
ADLINK Technology, one of the main contributors to the SMARC SGET committee, has announced the release of the SMARC module revision 2.1. The SGET (Standardization Group for Embedded Technologies) has just introduced the latest future-proof specification 2.1. The new features are only additional items that do not affect the multiplexing of existing signals and the pins of the edge connector assigned in the 2.0 specification, making the specification fully backward compatible with the current specification 2.0. The main additions are as follows: - Anticipating the needs of the AI and robotics markets, support for up to four MIPI CSI ports - Expansion of Ethernet ports through multiplexing of SERDES signals on the third and fourth PCIe x1 interfaces - Various minor additions for initially unused pins such as plus 2 GPIO pins and PCIe clock request signals
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ADLINK's latest edge DAQ system for machine condition monitoring, MCM-204.
Today, ADLINK Technology, a global provider of high-end edge computing products, announced the latest edge data acquisition system (DAQ) for machine condition monitoring, the MCM-204. With the release of the MCM-204, ADLINK's MCM lineup has been further enhanced, providing the most suitable MCM solution for batch configuration. The MCM-204, equipped with an ARM Cortex-A9 processor, is designed as a standalone DAQ device that does not require a host computer and features two Ethernet ports that enable data transmission back to a backend server and the construction of daisy-chain connections. It can also calculate commonly used vibration-related indices such as voltage, FFT, and RMS, allowing the benefits of edge computing to be implemented in large-scale infrastructure. Furthermore, it flexibly accommodates various data access options and allows for secure remote management and firmware/algorithm updates using the built-in web console. With all these features, the MCM-204 is ideal for real-time monitoring, analysis, and control from remote locations.
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Reduce time for prototyping and development with ADLINK's Industrial-Pi SMARC development kit.
ADLINK Technology, a global leader in edge computing, has announced the Industrial-Pi (I-Pi) SMARC (Smart Mobility ARChitecture) development kit designed for developers of industrial hardware platforms. ADLINK's I-Pi SMARC development kit provides developers with a low-cost platform. The industrial SMARC modules used are supported by ADLINK's change management process, allowing developers to experiment with peripheral devices and sensors at work or home to develop prototype versions of new products. While the development kit is commonly used for prototyping, it serves as an industrial-grade alternative to platforms like Arduino and Raspberry Pi (Rpi), which cannot typically be directly repurposed for standard industrial solutions.
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ADLINK Japan will be speaking at the NVIDIA AI seminar for Smart Logistics held in Tokyo on February 27!
ADLINK's partner companies, NVIDIA and RYOHYO ELECTRO, will co-host the "NVIDIA AI Seminar for Smart Logistics" themed around logistics warehouses at Akihabara UDX. GPU computing utilizing AI is beginning to be used in various applications. This seminar will provide a valuable opportunity to hear from various vendors about the latest market trends and case studies related to logistics warehouses, as well as an explanation of why the adoption of AI is needed now. Additionally, our company, ADLINK Japan Co., Ltd., represented by President Hattori and Sales Department Manager Kiuchi, will present on the initiatives of the Cabinet Office's special agency, the Space Development Strategy Promotion Office, regarding GNSS terminals using quasi-zenith satellites, as well as topics related to ROS2 and AI. GNSS terminals can achieve sub-meter level positioning and, through high-precision positioning combined with vibration, altitude, and temperature data, will expand the possibilities of our customers' IoT products. We invite you to participate in this seminar. Hosted by: NVIDIA, RYOHYO ELECTRO
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ADLINK Japan will be speaking at the NVIDIA AI seminar for Smart Logistics held in Osaka on November 28!
ADLINK's partner companies, NVIDIA and RYOHYO ELECTRO, will co-host the "NVIDIA AI Seminar for Smart Logistics" in Osaka, focusing on logistics warehouses. GPU computing utilizing AI is beginning to be used in various applications. This seminar presents a valuable opportunity to hear from various vendors about the latest market trends and case studies related to logistics warehouses, as well as an explanation of why the adoption of AI is necessary at this time. Additionally, our representative, Mr. Oguchi, the West Japan Branch Manager of ADLINK Japan, will present on the initiatives involving GNSS terminals using quasi-zenith satellites, developed by the Cabinet Office's special agency for space development strategy promotion. GNSS terminals can achieve sub-meter level positioning and, through high-precision positioning that combines vibration, altitude, and temperature data, expand the possibilities of our customers' IoT products. We encourage you to take this opportunity to participate in the seminar. Organizers: NVIDIA, RYOHYO ELECTRO
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ADLINK Japan will exhibit at the "2019 AI/Cloud Computing Day Tokyo" held on Tuesday, October 29, 2019, at Bellesalle Tokyo Nihonbashi!
Cloud Computing Day Tokyo has been held annually since 2013. This year's theme for the 7th event is "Move Cloud to AI + Edge." AI will pave the way for 5G, while edge computing will play a crucial role in realizing the world of AI, IoT, and 5G. The adoption of AI and edge computing will raise new expectations for always-on high-performance networks and services, leading many companies to embrace large-scale automation and leverage vast applications. Furthermore, the integration of Open RAN (O-RAN) will enhance the openness of 5G infrastructure by decoupling telecom software from telecom hardware, minimizing proprietary hardware, and cloudifying hardware infrastructure. We invite you to attend the 2019 AI/Cloud Computing Day Tokyo. Register here: http://opencomputejapan.org/archives/2480 We look forward to seeing you there.
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A low-power, compact COM Express module featuring a 15W quad-core 8th generation Intel Core SoC.
The new compact-sized COM Express Type 6 module, cExpress-WL, featuring the latest 8th generation Intel Core processors (codenamed "Whiskey Lake-U"), has been announced. With the ultra-low power Intel Core i7 and i5 processors now supporting four cores for the first time, it has achieved performance that surpasses products using the previous generation's dual-core processors by nearly 40%, without significantly increasing the module price.
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ADLINK partners with Google Cloud to provide IoT-enabled solutions.
ADLINK Technology has decided to partner with Google Cloud to integrate ADLINK's hardware and software solutions into Google Cloud IoT products. This will enable customers to easily enhance business value through the utilization and analysis of critical operational data.
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ADLINK joins the ROS 2 Technical Steering Committee.
ADLINK Technology has announced that it has joined the ROS 2 Technical Steering Committee organized by Open Robotics. The Robot Operating System (ROS) is an open-source resource for robot development. The ROS 2 TSC sets technical directives for open robotics and is composed of organizations that actively contribute to the development and advancement of ROS 2.
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ADLINK continues to support COM Express Type 2.
The latest COM Express Type 2 computer-on-module featuring the highly popular 6th/7th generation Intel Core processors (codenamed "Skylake" and "Kaby Lake") has been announced. The new Express-SL2/KL2 module supports all traditional I/O related to Type 2, allowing for a minimum extension of at least 10 years for the product lifespan of existing Type 2 compatible systems.
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ADLINK signs Preferred Partner Agreement with NVIDIA Jetson.
ADLINK Technology, a global provider of edge computing solutions and an NVIDIA Quadro Embedded Partner, has signed a Preferred Partner agreement with NVIDIA Jetson. This partnership will enable the adoption of NVIDIA Jetson modules, leading to enhanced edge AI platforms and accelerated edge AI deployments, which is expected to strengthen ADLINK's portfolio in cutting-edge AI (artificial intelligence).
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Enhance remote monitoring and management with ADLINK's MCM solution.
The company announced the upgrade of its MCM equipment environmental monitoring solution with the release of a remote facility information dashboard that allows for integrated management of sensor management, data collection, edge platforms, and vibration analysis. Users can simultaneously monitor multiple system devices and manage real-time information on machine operations, enabling the development of efficient and dynamic preventive maintenance strategies that help reduce downtime and expand production capacity.
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ADLINK announces the latest rugged fanless real-time video/image analysis AIoT platform for railways.
Artificial intelligence (AI) technology is being introduced into various industries around the world to improve efficiency and productivity while reducing costs, and the railway industry is no exception. The operation of railways utilizing AI-enabled systems and applications enhances safety, functionality, and reliability, resulting in significant improvements in passenger travel experiences and freight transport services. For these AI-driven applications to function effectively, accurate data input collected from numerous IoT (Internet of Things) devices installed at stations, on trains, and along railway lines is essential. The success of such railway applications requires seamless integration of AI technology and IoT technology. ADLINK provides advanced AIoT solutions for railway transportation, enabling customers to develop various applications with true value and performance by leveraging over 20 years of expertise and technology to develop embedded computing systems that excel in availability and reliability.
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ADLINK's EDGE AI platform, utilizing NVIDIA's EGX, enables next-generation computing and real-time edge AI.
The rapid expansion of IoT (Internet of Things) devices is leading to a surge in data volume. By 2025, it is expected that data requiring processing will be continuously transmitted from 15 billion machine sensors and IoT devices. In 2019, the global investment in AI (artificial intelligence) systems is projected to reach $35.8 billion, which is 44.0% higher than in 2018. This demand forecast far exceeds the capabilities of existing CPU platforms.
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ADLINK releases the latest touch panel computer equipped with driver and machine interface for train control and railway signaling systems.
Today, ADLINK Technology announced the DMI-1210, a touch panel computer equipped with the latest driver machine interface (DMI) specifically designed for train control and driver information displays. The DMI-1210 features an Intel Atom x5-E3930 processor (codenamed Apollo Lake), a 12.1-inch (4:3) high-resolution display, a 5-wire resistive touchscreen, and a securable I/O interface. It can be implemented in various applications such as HMI units for the driver's cabin, control panels for passenger information systems, control/display units for remote monitoring systems, and train diagnostics and communication applications.
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[ADLINK] Exhibiting at the 8th IoT/M2M Exhibition (Spring) of Japan IT Week Spring 2019.
This year, the largest IT exhibition in Japan, where cutting-edge IT solutions gather, "Japan IT Week [Spring]" will be held at Tokyo Big Sight. Our company will be exhibiting at the 8th IoT/M2M Exhibition [Spring], which is attracting attention. At this exhibition, we plan to showcase new products from various fields this spring, including AI & ROS, edge computing, and IIoT solutions. We will also be displaying NVIDIA products and Intel Movidius products.
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Angelo Corsaro, CTO of ADLINK, has been selected for the Power 200 as one of the "Most Influential Data Economy Leaders in the World."
Dr. Angelo Corsaro, CTO of ADLINK Technology, has been recognized as one of the world's most influential leaders in the data economy in the fields of data centers, cloud, and data. He was selected for the "Power 200" by Data Economy magazine for his innovative thinking, business acumen, and entrepreneurial skill set.
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[ADLINK] Exhibited at the 3rd Kansai IoT/M2M Exhibition during Japan IT Week Kansai 2019.
ADLINK Japan will exhibit at the "3rd Kansai IoT/M2M Exhibition" held at Intex Osaka from January 23 (Wednesday) to January 25 (Friday), 2019! We will showcase ADLINK products, including the latest IIoT gateways, smart solutions, and data sharing platforms. ADLINK offers a cutting-edge IoT and embedded technology portfolio that includes devices, gateways, and network infrastructure services, enabling IoT across diverse vertical markets.
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ADLINK has announced two new CompactPCI 2.0 processor blades featuring the latest Intel Xeon, Core, and Atom processors.
Today, ADLINK Technology has released two types of the latest CompactPCI 2.0 processor blades, the cPCI-3630 and cPCI-6636. The ADLINK cPCI-3630 is a 3U CompactPCI processor blade that features the 64-bit Intel Atom processor X series SoC (codenamed Apollo Lake-I) and supports up to 8GB of soldered DDR3L-1600 MHz ECC memory. The Intel Atom processor X series integrates a low-power 9th generation graphics engine, providing advanced graphics, media, and display capabilities. The cPCI-3630 supports single-slot (4HP) or dual-slot (8HP) form factors, allowing for a wide range of total board options to provide extensive I/O functionality. One of the dual slots supports a layer 2 XMC site. Storage options include an onboard 32GB SSD, CFast or mSATA sockets, and 2.5" SATA drive space on the layer 2 riser card.
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ADLINK releases the first "Quad" Core i3 value processor with COMExpress.
It was announced that the latest Express-CF, featuring the 8th generation Intel Core i5/i7 and Xeon processors (formerly code-named: Coffee Lake), has added the quad-core Intel Core i3-8100H processor to the COM Express-CF Basic Size Type 6 module. Previous generations of Intel Core i3 processors only supported dual-core with 3MB cache, but the Intel Core i3-8100H supports four CPU cores with 6MB cache in the same class. This major upgrade results in over 80% performance improvement in MIPS (million instructions per second), nearly doubling memory/caching bandwidth, and enabling cost reductions compared to previous generations.
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ADLINK adds FogHorn's edge intelligence capabilities to its IoT DXS (Digital eXperiments as-a-Service) service.
ADLINK Technology has partnered with FogHorn Systems, a leading developer of software for industrial and commercial IoT solutions, to add edge intelligence capabilities to ADLINK's groundbreaking IoT DXS (digital experiments as-a-service) service. The DXS service enables the validation of IoT-based potential efforts that determine the possibilities of solutions while minimizing upfront investments and risks associated with a full-solution commitment.
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ADLINK releases IoT DXS (Digital eXperiments-as-a-Service) service to reduce costs and risks.
The announcement of an innovative IoT DXS (Digital Experiments as-a-Service) has been made. This service verifies the potential of IoT-based efforts that determine the possibilities of solutions while minimizing upfront investments and risks associated with a full-solution commitment. Full IoT solutions typically require substantial upfront investments, but industry research indicates that the success rate of such projects is only 26%. On the other hand, the concept of digital experiments emerged from the fusion of IT best practices and OT (Operational Technology). ADLINK's unique DXS not only provides all the benefits of digital experiments to operators but also enables timely execution of experiments without vendor dependency and without related upfront investments.
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ADLINK has released the first COM Express Type 6 module compatible with Intel Core and Xeon hexacore processors.
A new COM Express Type 6 module has been announced, further enhancing ADLINK's product line to meet the requirements of applications that demand the highest performance. ADLINK's Express-CF module features Intel Xeon and 8th generation Intel Core processors (formerly codenamed Coffee Lake H) with support for up to 6 cores (hexa) and 48GB of memory capacity, providing uncompromising system performance and responsiveness, making it ideal for demanding applications such as image processing and analysis, high-speed encoding and streaming of 4K video, medical ultrasound, and traffic situation prediction.
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Accelerating prototypes of innovative smart device solutions with ADLINK's smart panel.
ADLINK Technology, a global provider of leading-edge computing solutions that inspire creative user experiences across industries, has announced its SP (Smart Panel) solution, which drives innovation in smart device development. This all-in-one, open-frame panel PC offers flexible configurations through advanced modularization. By using the SP, which incorporates ADLINK's unique Function Module (FM) design, you can accelerate prototyping based on application requirements, saving time, effort, and costs. System integrators, integrated solution providers, and brand vendors can all succeed in projects across applications such as transportation, retail, customer service, industrial automation, healthcare, and gaming.
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Compass Intelligence has selected ADLINK as this year's Edge Computing Company.
ADLINK Technology, a global provider of leading-edge computing solutions, has won the 6th "Compass Intelligence" award as this year's edge computing company. The award recognizes the best companies, products, and technology solutions in the mobile, IoT, and emerging technology industries. ADLINK was honored in the field of IoT data.
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ADLINK partners with FFG for the "Factory of the Future" supporting 5G and ROS2.
ADLINK Technology, a global leader in edge computing, has partnered with FFG (Fair Friend Group) to promote a new project titled "ROS2 toward Converged 5G for Factories of the Future." This partnership will provide a system architecture that integrates wireless 5G network technology with the ROS2 (Robot Operating System 2) platform, enabling rim control and reliable communication. The project is expected to act as a catalyst for the next generation of growth in network communication, driving the development of the Industry 4.0 ecosystem and revolutionizing productivity in the "Factories of the Future."