すべての製品・サービス
1～21 件を表示 ／ 全 21 件
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High-performance direct exposure device *for circuit patterns *for solder resist
LED/LD hybrid wave lens: high speed, high production capacity, and high cost performance.
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Next-generation substrate conductor layer formation "PVD device" - World first! Direct copper deposition.
Using sputtering technology in a medium vacuum environment, we have developed the world's first plating seed layer formation technology through direct copper deposition! Achieving productivity beyond conventional levels!
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Projection Exposure Device "MRS Series" adopts UV-LED light source.
Wafer size post-process projection exposure equipment MRS adopts UV-LED light source as the standard light source (enabling reduction of running costs without sacrificing productivity!)
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UV-LED Light Source for Exposure Machines "ULA Series"
An alternative to mercury lamps! Customizable for various optical specifications!
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CVS analysis device "QUALILAB ELITE" additive concentration measurement
Essential measurement of additive concentration for plating solution analysis! Supports two-component and three-component additives (inhibitors, accelerators, leveling agents). Compatible with major additive manufacturers!
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Full panel mass production projection exposure equipment 'CMS-Ck' ★ Demo now available!
Improves resolution and alignment accuracy, compatible with mass production processes. Adopts UV-LED light sources to reduce running costs.
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Oxide film and metal film thickness measurement device Surface Scan【CP-M1】
Introducing a high-performance film thickness measurement device that allows for the "easy" and "quick" measurement of various metal oxide films and metal films using the continuous electrochemical reduction method!
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Shadow Moiré Type Substrate Warpage Measurement Device TherMoiré AXP3
Measuring the warping of the substrate during heating using shadow moiré measurement! ◆Warping data obtained in about 2 seconds per point! ◆Achieving a resolution of 0.5 microns!
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Metal surface treatment agent [SSP series] - Removes impurities without etching!
Almost no etching, surface impurity treatment, rust prevention effect, increased hydrophobicity, improved adhesion with resist, enhanced surface resolution, and cost reduction through process reduction!
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TherMoiré Shadow Moiré Type Curvature Measurement Device Various Options
You can select a measurement method that suits your measurement application (sample). Measurements can be taken under various conditions such as implemented products, strain, and when cooled!
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Introduction to the product lineup of the heating warp measurement device by Akrometrix.
We introduce a lineup of various substrate warpage measurement devices manufactured by Akrometrix! There are a total of four types.
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Therma Precision Co., "Light Source Device"
This is a light source device developed by our company. Please feel free to request designs with creative ideas for development and manufacturing purposes.
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Fully automatic centrifuge rare earth recovery device
Precision filtration using centrifugal force of 1700G (maximum 3000G) and the ability to recover low moisture content sludge!
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Silicon sludge recovery device from silicon processing wastewater using a centrifuge.
High-purity recovery with a low-wear structure that suppresses the mixing of impurities into silicon sludge. Stable recovery of silicon sludge with a moisture content of approximately 30%!
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Next-generation laminate "Clear Sheet" for printed circuit boards, featuring independent bubbles for insulation and cushioning.
It absorbs shock energy and has a cushioning effect due to independent bubbles. It also excels in elasticity, resilience, and durability! The anti-static agent prevents static electricity and foreign substances.
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Substrate cleaning machine "VSC727" supports pattern shapes with a special brush.
Effective for removing particles between fine pattern patterns! Easy to attach and detach the brush unit!
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Copper plating thickness measurement device "Cabidarm" - Handy type for easy measurement!
Automation is possible at various points! Instant measurement of copper film thickness and the potential for increased production efficiency through advanced statistical processing is here!
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"FOAMKILLER" Development Use [Completely Non-Silicone] Dispersion Antifoaming Agent
This is a revolutionary defoamer that ensures both immediate and lasting effects without containing silicon. It has almost no contamination risk and excellent sludge dispersibility!
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Development, etching, stripping "wet equipment" - over 200 lines of implementation results.
Adopted by world-class PCB manufacturers! Capable of handling thin substrates without damaging the boards. Various latest designs available! Please take a look at the catalog.
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Efficient and uniform coating on printed glass substrates with a slit coater.
Slit coater for applying functional materials to various substrates such as ceramics, glass, and films ● Inkjet coater can also be proposed.
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X-ray board inspection device "SX Series" specialized for multilayer boards and assembled boards!
It is a high-performance inspection device specialized for multilayer substrates and mounting substrates, featuring easy operation, high quality, and compact design!
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