Cushion material "ACE BOARD X・CX Series"

For printed circuit board manufacturing! Recommended for FR-4, BT resin, and PPE boards, etc.

last updated May 16, 2024

Cushion Material for Printed Circuit Board Manufacturing "ACE BOARD C Series"

Recommended for CEM-1, CEM-3, and FR-1 substrates! Supports automatic transport via suction.

last updated May 16, 2024

Cushion material for printed circuit board manufacturing "ACE BOARD Z Series"

The decomposition temperature of the structural fiber (PBO) is 650°C! Recommended for LCP and fluorine substrates, etc.

last updated May 16, 2024

Industrial felt

Active in various manufacturing sites! Applications such as "filtration" and "wiping" are expanding even further.

last updated Mar 31, 2025

Cushion material for printed circuit board manufacturing "ACE BOARD(R)"

Cushioning material for substrate manufacturing that combines high heat resistance and lasting cushioning properties.

last updated Aug 20, 2025

Aluminum extrusion felt "THERMOTEX(R)"

A rich lineup tailored to the temperature and transportation form of aluminum extruded materials!

last updated May 16, 2024

Felt for steel plates (roll cover for galvanized line) *Materials available!

By adding more felt to the contact area (crown part), it is also possible to extend its lifespan!

last updated May 16, 2024