[Exhibition Information] We will be exhibiting at 'SEMICON JAPAN 2025'.

クボタ計装

We will be exhibiting Kubota's semiconductor inspection equipment at SEMICON JAPAN, an international exhibition of manufacturing technologies, equipment, and materials in the semiconductor industry. All of our staff sincerely look forward to your visit. 【Exhibition Information】 Date: December 17 (Wed) - 19 (Fri), 2025, 10:00 - 17:00 Venue: Tokyo Big Sight Booth Location: W1963 *Advance registration is required for attendance. Please check the SEMICON JAPAN website for registration details.

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Related product information

Microscopic wafer surface defect inspection device
High-precision inspection equipment compatible with transparent materials.

【Detection】 Method: Image analysis method using differential interference microscopy Detection size: 0.3um (when using a 10x objective lens) 【Target Substrate】 Type: Various substrates including transparent materials Size: 4 inch, 6 inch, 8 inch, available upon separate consultation 【Device Size】 External dimensions: W1,700 x D1,000 x H1,935 (mm) Weight: Approximately 800kg
Wafer appearance inspection equipment (automatic visual inspection equipment)
Automating visual inspection of wafer defects.

【Minimum Detectable Defect】　30um 【Target Shape】　Circular: Diameter less than 200mm 　Rectangular: Less than 140mm□ 　*If you would like to measure sizes larger than the above, please consult us. 【Inspection Time】　100 PPH
Wafer surface defect inspection device with review function
Equipped with a review microscope! Defects detected can be observed in real-time with the microscope.

【Detection】 Method: Laser scattering method and specular reflection method Detection size: Defects equivalent to PSL 50nm 【Review Function】 Microscope: Laser microscope (laser confocal, white light interference) or differential interference microscope 【Target Substrate】 Type: Various substrates including transparent materials Size: 2 to 12 inches, shape and other details can be discussed separately 【Equipment Size】 External dimensions: W1,800 x D2,100 x H1,985 (mm) Weight: Approximately 1200kg
Laser-type wafer surface defect inspection device - Laser Explorer
Transparent wafers also undergo high-speed inspection! High-output lasers detect tiny scratches and particles!

【Main Specifications】 (Model: LE-W1) Detection Method: Laser scattering method, reflection method, phase shift method Detected Defects: Particles, scratches, pits, hillocks, stains, etc. Target Materials: Si, SiC, GaN, LT, sapphire, etc. Target Sizes: 2, 4, 6, 8 inches (other sizes available upon consultation) Inspection Time: Approximately 90 seconds per sheet (4 inches, 10μm pitch, including transport time) Laser Wavelength: 405nm Inspection Pitch: 5 to 30μm Result Output: Map, categorized graphs, list, size classification Equipment Dimensions: W 1800 × D 990 × H 1490 (mm) *For more details, please refer to the catalog. Feel free to contact us with any inquiries.