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[New Product Announcement] Thermal Conductive Hot Melt TC50

松本加工

松本加工

We have received numerous requests for thermal conductive hot melt. We are pleased to announce a hot melt that achieves excellent thermal conductivity with a thermal conductivity rate of 0.65 W/m·K (300% compared to conventional products). It meets the requirements for both encapsulation and heat dissipation for control boards in drive systems and substrates for LED lighting. We will be distributing sample pieces at AUTOMOTIVE WORLD 2018. Date: January 17-19, 2018 Venue: Tokyo Big Sight, Booth No. E65-100 We look forward to your visit.

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