All products and services
1~30 item / All 45 items
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Bio-based polyamide "LEXTER"
A material with low water absorption and minimal changes in physical properties even after water absorption! It is suitable for CFRP matrix resin.
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Thermoplastic polyimide resin "Saprime" for super engineering plastic alloy applications.
Suprem (TPI) can be used for alloying with various super engineering plastics (TPI, PEI, PES, PPSU, LCP, PEEK).
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Thermosetting resin prepreg "ENDUREDGE"
This is a thermosetting prepreg that can be stored at room temperature, reducing void formation and achieving a good appearance! It allows for a reduction in man-hours and costs throughout the entire molding process.
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High-performance polycarbonate resin woven prepreg
Prepreg sheets with excellent heat resistance and impact resistance unique to polycarbonate resin.
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Gas barrier CFRP matrix resin "BARRIZOW"
We have developed a resin with high gas barrier properties against hydrogen, suitable viscosity for various tank molding methods, and a shelf life for storage!
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Prepreg yarn made from high-performance polyamide resin fibers.
Blended yarn (comingle yarn) made from high-strength, high-rigidity, and thermoplastic polyamide resin PA-MXD6 series fibers with good moldability.
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UD tape "Leni Tape" made with high-performance polyamide resin.
UD tape impregnated with high-performance polyamide resin PA-MXD6 in continuous fibers.
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Emergency Power Supply / Uninterruptible Power Supply "Direct Methanol Fuel Cell Power Supply System"
Power backup for over 7 days is possible! Achieves quiet operation that can be used at night and indoors!
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Thermoplastic polyimide resin "Saprime" [Excellent moldability and heat resistance!]
This is a resin that combines excellent moldability and heat resistance, available for use in various fields such as industrial parts, aerospace, automotive, and energy!
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UD tape using thermoplastic polyimide resin "Saprime"
UD tape made from thermoplastic polyimide resin with high heat resistance and good moldability.
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Fatty cyclic anhydride-based curing agent 'H-TMAn'
The anhydride-based curing agent "H-TMAn" has a high Tg (250°C), excellent mechanical properties, UV resistance, and strong adhesion.
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Innovative epoxy resin curing agent application of diamine monomer '1,3-BAC'
Epoxy curing agent, with excellent UV resistance, transparency, and fast curing.
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Thermoplastic Polyimide Therplim Low Friction Grade "TS2400W"
Therplim low friction grade "TS2400W" achieves higher strength, elastic modulus, lower wear, and lower dynamic friction coefficient than PEEK low friction grade!
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『Therplim』 Wear resistance grade
Therplim「TS2400W」achieves higher strength, lower wear than PEEK!
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Polyimide Therplim Low Friction Grade
Suitable for complex-shaped components and high-performance molded parts! High fluidity allows for high fiber filling.
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Matrix resin for "Therplim" CFRP.
Due to its high heat resistance and good moldability, it is most suitable for CFRP matrix resin.
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Thermoplastic polyimide resin Therplim powder filler application for toughness modifier in CFRP.
Improved toughness, enhanced sliding properties, and low dielectric effects from various powder additives! Introduction to powder filler applications.
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Low dielectric thermoplastic polyimide Therplim for high-speed communication devices (5G)
Suitable for super engineering plastics with good dielectric properties in a wide frequency range and materials for next-generation (5G) communication devices.
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Thermoplastic Polyimide Resin "Therplim"
Thermoplastic polyimide resin with unprecedented moldability and heat resistance.
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『Therplim』 Low Friction Grade
For complex shape members and high-performance molded members!
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Therplim impact modifier forCFRP
「Therplim」 provides toughness, slidability and low dielectric.
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Matrix resin for CFRP 『Therplim』
High heat resistance and good moldability for CFRP matrix resin.
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Thermoplastic polyimide Therplim
Polyimide resin that has both moldability and heat resistance.
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Low dielectric thermoplastic polyimide "Saprime" for high-speed communication devices (5G)
Super engineering plastics with excellent dielectric properties over a wide frequency range, suitable for next-generation (5G) communication equipment!
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Thermoplastic polyimide resin "Surprim Sliding Grade TS Series"
The Suprem Sliding Grade "TS2400W" achieves higher strength, elasticity, lower wear, and a lower dynamic friction coefficient than the PEEK sliding grade!
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Supreme Gear Bearing Molding Example
A high glass transition temperature of 185℃! Introducing examples of gear and bearing molding that allow for various shapes.
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Examples of Suprem Film Molding
Introducing examples of film molding of Surprim, boasting low dielectric properties and high toughness, with Tg of 185°C and Tm of 323°C!
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"Supreme" powder filler application (CFRP toughness enhancer)
There are many effects of powder additives such as improved toughness, enhanced sliding properties, and low dielectric properties! Introducing the applications of powder fillers.
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"Supreme" CFRP matrix resin
Due to its high heat resistance and good moldability, it is ideal for CFRP matrix resins.
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Crystalline thermoplastic polyimide "Saprime fiber-reinforced grade"
For complex-shaped components and high-performance molded parts! Due to high fluidity, high fiber filling is possible.
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