すべての製品・サービス
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Development and prototyping environment for semiconductor packaging - equipment/devices
We have a variety of equipment necessary for development prototypes and evaluation analysis environments!
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Cutting-edge technology that realizes miniaturization and high performance of semiconductors!
Bear chip mounting, flip chip mounting, wire bonding, and stud bumping. We support all types of board mounting!
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Ultra-compact CMOS camera module "IKURA Series"
Ultra-compact USB camera module compatible with YUV (uncompressed) output and MJPEG output!
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Prototyping and manufacturing of "Small Custom SiC Power Modules"
Achieved miniaturization to half the size compared to conventional models!
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Development and manufacturing of semiconductor and sensor packaging & camera modules.
Leave the prototyping and implementation of sensors and camera modules to us!
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Contracted Service "Mass Production Manufacturing Service"
Total support from design to medium-scale production! We also accept requests for specific tasks and small quantities with a flexible production system!
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Contracted Service "Development and Prototyping Service"
Development, prototyping, and evaluation services utilizing know-how in bear chip implementation and micro joining technology.
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Micro Module Technology Corporation - Business Overview
Support for miniaturization and modularization of circuit implementation boards using bare chip implementation, from concept to prototype to mass production!
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Development and manufacturing of semiconductor and sensor packaging & camera modules.
One-stop support for the development and prototyping of semiconductor and sensor packaging, as well as semiconductor modules, utilizing semiconductor bare chip mounting technology for small to medium-scale production.
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