A sensor that achieves high-precision and high-speed shape measurement.
For inline inspection. Supports scanning at 70,000 points per second. Can also measure film thickness. For semiconductor wafer inspection applications.
Our company offers a system that combines the ultra-fast optical scanner 'Flying Spot Scanner (FSS)', which can perform 3D shape measurements with a maximum diameter of 80mm at high speed, with dedicated sensors. It is capable of measuring flatness, thickness, shape, and the arrangement of layers and components both vertically and horizontally with high precision and speed. We also have a wide range of sensors available, which can be selected according to the required measurement range and accuracy. 【Features of FSS】 ■ High precision: Minimum Z-direction resolution of 5nm ■ High-speed scanning: 70,000 points/second ■ Suitable for inline measurement ■ Partial measurements can be freely conducted within the measurement range *For more details, please refer to the materials. Feel free to contact us as well.
basic information
【Specifications】 《FSS Specifications》 "FSS80" Principle: Spectral Interference Lateral Resolution: 21μm Resolution (Z): Minimum 5nm Scan Area: 80mm "FSS40" Principle: Spectral Interference Lateral Resolution: 6.5μm Resolution (Z): Minimum 5nm Scan Area: 40mm 《Sensor Example》 "CHRooodile 2 DW 250" Measurement Range: 0 to 1800μm (for shape measurement) Z Direction Resolution: 5nm Z Direction Linearity: 0.6μm Sampling Rate: 70kHz Light Source: Infrared SLD Communication Method: Ethernet, RS422, Analog, LVDT *For more details, please refer to the documentation. Feel free to contact us with any inquiries.
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Applications/Examples of results
[Keywords: Applications, Measurement Items, Benefits, etc.] Non-contact sensors, optical sensors, spectroscopic interference method, thickness, thin films, thick films, gaps, height, flatness, TTV (Total Thickness Variation), shape, measurement, inspection, high speed, 3D, area scan, full surface, high precision, inline, monitoring, offline, standalone devices, tabletop devices, semiconductors, wafers, wafer bonding, Si wafers, Si, GaAs, InP, SiC, LiNbO3 (LN), LiTaO3 (LT), GaN, SiP, Al2O3 (sapphire), PCB, medical balloons, barrier films, PET films, coatings, films, multilayer films, coated films, conformal coatings, electrode layer coatings, stent coatings, polyimide, PVB, resin materials, flux, adhesives, insulating films, air layers, transparent, transparent bodies, gloss, mirror finish, simple.
