CHRocodile 2 SX Optical Wide-Range Thickness Measurement Sensor

Optical sensor for measuring a wide range of thickness from 0.5 to 200 um. High-speed sampling at 5 kHz. Ideal for monitoring applications during processing.

Non-contact optical thickness measurement. Applicable for thickness measurement of semiconductor wafers where high precision is required. The new product 'CHRocodile 2 SX' is a device that can measure the thickness of materials such as wafers and coatings without contact. It supports high-speed sampling of up to 5 kHz, making it suitable for inline applications. In addition to measuring the thickness of semiconductor wafers like Si, it can also measure the thickness of films, resins, glass, solar cells, and more. In particular, when thickness monitoring is desired during wafer grinding, it can measure thicknesses from 200 µm to 0.5 µm for Si wafers. 【Features】 ■ Wide range of thickness measurement, compatible with various materials With a rich lineup of probes, it can measure thicknesses from thin films (around 2 µm) to thick films (1000 µm) at optical lengths, and from 0.5 to 200 µm for Si. ■ High resolution (sub-micron, minimum 3 nm @ optical length) ■ Contributes to reducing development costs and shortening development lead times, with a software development kit (DLL, etc.) available for device integration ■ Extensive track record in the semiconductor industry *For more details, please refer to the documentation.

basic information

【Other Features】 ■Measurement Range: 2μm to 1000μm (n=1) 0.5μm to 200μm (n=3.8, etc.) ■Resolution: Up to 3nm (n=1) ■Measurement Frequency: 5kHz ■Interface: Ethernet, RS422, Analog (2ch) *For more details, please refer to the PDF document or feel free to contact us.

Price range

Delivery Time

OTHER

Model number/Brand name

CHRocodile 2 SX

Applications/Examples of results

【Applications】 ■Thickness measurement of semiconductor wafers such as Si 　Thickness measurement of films, resins, glass, liquid crystal gap cells, solar cells, etc. 　and measurement of doped wafers. *For more details, please refer to the PDF document or feel free to contact us. 【Keywords related to applications, measurement items, benefits, etc.】 Non-contact sensors, optical sensors, spectroscopic interference method, thickness, thin films, thick films, gaps, shapes, measurement, inspection, high speed, high precision, inline, monitoring, in-situ, during processing, before and after processing, polishing, semiconductors, wafers, wafer bonding, Si wafers, transparent, transparency, gloss, mirror finish, easy.