【TAIYO】FPC Manufacturing Technology: "Announcement Regarding the Development of All-Polyimide Build-Up Substrates"
太洋テクノレックス 本社 和歌山
Our company is working on the development of build-up substrates using polyimide for the insulating layer, aimed at miniaturizing, thinning, and lightening multilayer substrates in our core electronic substrate business. We are pleased to announce that we have established the core filled via technology. In electronic devices that are becoming lighter, more compact, and high-functioning, substrates (build-up substrates) capable of high-density wiring and high-density mounting are in demand. However, typically, the core layer of build-up substrates uses rigid boards, which increases the thickness of the substrate and hinders the lightweight and compact design of electronic devices. The filled via technology we have established involves filling holes (vias) made by laser in flexible printed circuit boards (FPC) with an insulating layer of polyimide with copper, and flattening the surface of the filled areas. By using this FPC as the core layer or outer layer of build-up substrates, it becomes possible to achieve both high-density wiring and high-density mounting along with thinning. We plan to start providing build-up substrates using this technology within the fiscal year 2022, and furthermore, by applying this technology to our strength in high-frequency compatible FPCs, we will respond to the demand for miniaturization of communication devices.
