◎FPC (Flexible Printed Circuit Board): Under the theme of "Discovering Applications for FPC," you can experience the characteristics of FPC in four zones: lightweight, flexible, fine, and special. 1. Comparison of weight between rigid boards and FPC 2. FPC that you can actually touch and bend 3. Reduction of board area due to high-density wiring 4. FPC with special features such as transparent, high-frequency, and pressure-resistant types Additionally, we are also showcasing next-generation circuit technologies such as stack vias and via fills. It's not just about FPC! We have live demonstrations of 'FA Automation' and the latest appearance inspection system using AI technology! ◎FA Automation: By achieving teaching-less automation through visual feedback control, we eliminate the burden of calibration and realize high-precision, high-speed operation. We have prepared a demonstration for the transport of rigid boards. ◎The latest final appearance inspection system, the AI system 'TY-VISION XAIS,' is now in Chapter 2! In addition to improving efficiency by reducing false positives in the final appearance inspection process, it also supports defect detection using AI. It is effective for defects with minimal brightness differences that are difficult to detect with inspection devices, even though they can be identified visually.

◎FPC (Flexible Printed Circuit Board): Under the theme of "Discovering Applications for FPC," you can experience the characteristics of lightweight, flexible, fine, and special FPCs in four different zones. 1. Comparison of weight between rigid boards and FPCs 2. FPCs that you can actually touch and bend 3. Reduction of board area due to high-density wiring 4. FPCs with special features such as transparent, high-frequency, and pressure-resistant types Additionally, we are also showcasing next-generation circuit technologies such as stack vias and via fills. Not only FPCs! We also have a live demonstration of the latest appearance inspection system using AI technology in the fields of FA and automation! ◎FA Automation: By achieving teaching-less operation through visual feedback control, we eliminate the burden of calibration and realize high-precision, high-speed automation. We have prepared a demonstration of rigid board transport and are waiting for you. ◎The latest final appearance inspection system, the AI system "TY-VISION XAIS," is now in Chapter 2! In addition to improving efficiency by reducing false reports in the final appearance inspection process, it also supports defect detection using AI. It is effective for defects with low brightness differences that are difficult to detect with inspection equipment, even though they can be identified visually.

Ultra-fine lines, high density, and high-resolution flexible printed circuit boards have made it possible to form ultra-fine circuits through the fusion of MSAP technology and via filling technology! For modularization in medical devices and next-generation communication systems! The miniaturization and enhancement of electronic devices are progressing, leading to a demand for finer circuit formation. 【Features of MSAP Technology】 ■ Circuit formation through electroplating enables high-precision fine wiring ■ Excellent rectangularity of wiring cross-section contributes to reduced transmission loss ■ Superior for high-frequency substrates and IC mounting The fusion of these two processing technologies has realized "ultra-fine line high-density FPC." #UltraFineLines #HighDensity #FPC #FlexibleSubstrate #FlexiblePrintedCircuitBoard

This is a very popular document. It provides a clear explanation of the general manufacturing process of FPC at our company, incorporating animation. Please take a look. 【Business Overview】 ■ Electronic Circuit Board Business - Design and production of flexible printed circuit boards - Assembly of printed circuit boards, etc. ■ Test System Business - Development and manufacturing of circuit board power-on inspection systems - Development and manufacturing of final appearance inspection systems for circuit boards, etc. ■ Industrial Machinery System (Trading Company) Business - Design and manufacturing of robot FA systems and automation systems, etc. ■ Mirror Polishing Machine Business (Mirak Co., Ltd.) - Manufacturing of mirror polishing machines and grinding machines, etc.

【Aggregation Period】April 5, 2023 - April 11, 2023 ★Company Ranking (Out of a total of 44,072 points) ￣￣￣￣￣￣￣￣￣￣￣￣￣￣￣￣￣￣ 4th Place: Taiyo Kogyo Co., Ltd. Wakayama 【Thank You】 Thank you very much for the many accesses. 【Company Overview】 Taiyo Kogyo Co., Ltd. operates in the fields of prototype development of flexible printed circuit boards (FPC) and the manufacturing of circuit board inspection equipment. FPCs are fundamentally related to the structure of hardware, requiring both high precision quality and shortened development periods. On the other hand, the circuit board inspection systems mainly include electrical inspection systems and final appearance inspection systems, which are also adopted in the mass production sites of FPCs and package/module type circuit boards. 【Business Activities】 ■ Electronic Circuit Board Business - Design and manufacturing of flexible printed circuit boards - Printed circuit board assembly and other services ■ Test System Business - Development and manufacturing of circuit board electrical inspection systems - Development and manufacturing of final appearance inspection systems and other services ■ Industrial Machinery System (Trading Company) Business - Design and manufacturing of robot FA systems and automation systems and other services ■ Mirror Polishing Machine Business (Mirak Co., Ltd.) - Manufacturing of mirror polishing machines and grinding machines and other services