FPC - "Technical Information" - Updated September 2025
I would like to introduce the "Technical Information" related to FPC.
● 6-layer stacked via FPC Achieves further high-density wiring with a stacked via structure using via filling technology. Contributes to improved design flexibility by effectively utilizing wiring space. ● MSAP method Realizes high-precision and high-density fine wiring with enhanced plating. Excellent rectangularity of wiring cross-section allows for wiring formation as envisioned. ● Pattern via fill FPC Achieves high-density wiring and pad-on-via by combining MSAP and via filling methods. ● Fine pitch thick copper FPC Contributes to miniaturization of devices with large current and high-density wiring. ● High-frequency fluorine composite 3-layer FPC Combines noise countermeasures and miniaturization with fluorine composite material FPC that has excellent dielectric properties. Suitable for conversion from coaxial cables. ● High-frequency compatible FPC Proposes optimal design and materials based on analysis results. ● Transparent FPC An FPC with excellent light transmittance and heat resistance, capable of chip mounting. Allows for wiring routing without compromising product design.
basic information
For detailed information, please contact us at the address below. Taiyo Technorex responds to various inquiries from our customers. Contact information: Head Office Wakayama: 073-431-6312 Tokyo Office: 03-6275-0690
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Applications/Examples of results
【Flexible Printed Circuit Boards】 We provide a wide range of support from quick prototype production of FPCs to smooth ramp-up for mass production, as well as offering mass-produced FPCs. 【Circuit Board Inspection Equipment】 We have a full range of equipment from manual to fully automated systems for final appearance inspection and electrical testing. 【Automation, Efficiency, Various Industrial Equipment】 We propose automation for manufacturing sites, leveraging our expertise in thin material handling as an FPC manufacturer. We also offer solutions for efficiency in conjunction with visual inspection systems, industrial inkjet printers, and other industrial equipment.
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Taiyo TechnoRex Co., Ltd. continues to operate in the fields of prototype development of flexible printed circuit boards (FPC) and printed circuit board testing systems. Since FPC is fundamentally related to the structure of hardware, both high precision quality and shortened development time are required. We have extensive experience and know-how in the manufacturing processes of single-sided FPC, double-sided FPC, multilayer FPC, and their advanced types, and we continuously improve and enhance our technology, resulting in consistent evaluations of our delivery times and quality. Additionally, while technically advancing further miniaturization and high density, we are also undertaking new initiatives such as bump-type and special material electroplating. On the other hand, our printed circuit board testing systems mainly consist of electrical inspection systems and final appearance inspection systems, which are adopted in the mass production sites of FPCs and package/module-type substrates. They operate day and night in quality control settings for substrates used in smartphones, automotive applications, and various electronic devices. We will continue to respond to the increasingly diverse market needs. *On December 21, 2023, the company name was changed from "Taiyo Kogyo Co., Ltd." to "Taiyo TechnoRex Co., Ltd."*