[Exhibition Report] We exhibited at NEPCON Japan 2026!
Here is a brief introduction to the successful exhibition content.
<Main Exhibition Content> ◆FPC (Flexible Printed Circuit Board)◆ ~Touch, Compare, Experience FPC!~ ●Comparison of weight between rigid boards and FPC ●Reduction of board area through high-density wiring ●Improved work efficiency with transparent FPC ●Introduction of black coverlay, etc. ~Technical Topics~ ●High-frequency compatible FPC / High-frequency analysis measurement... Proposing optimal designs and materials based on analysis results ●Fine pitch thick copper FPC... Contributing to miniaturization of devices with high-density wiring ●Pattern via fill 4-layer FPC... Achieving high-density wiring and pad-on-via ●6-layer stack via FPC... High-density wiring with stack via structure ~Our Initiatives~ ●Introduction of "Space" related business ●Demonstration of "Leak Detection Device" ◆Various Boards and Ceramic Material Systems◆ Introduction of AI technology, final appearance inspection equipment, and electrical inspection equipment (Semi-automatic appearance inspection equipment TY-VISION M105SC II) Live demonstration ◆Efficiency and Automation◆ Proposal for utilizing FA and collaborative robots (Appearance inspection system + ASSISTA = Efficiency) Live demonstration
basic information
* Flexible printed circuit board * FA (Factory Automation) * Final appearance inspection system For more details, please contact us at the information below. Taiyo Techno-Rex will respond to various inquiries from our customers. Contact information: Head Office Wakayama: 073-431-6312 Tokyo Office: 03-6275-0690
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Applications/Examples of results
Please leave the FPC design, prototype, small to medium lot production, and implementation to us. We propose systems suitable for final appearance inspection of high-precision substrates, ceramics, and more, utilizing material handling and collaborative robots for FA and automation. For detailed information such as photos of the exhibition venue and exhibits, please refer to the "Exhibition Report_Nepcon Japan 2026."
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Press Release from Taiyo Techno Rex: Regarding the Conclusion of a Business Outsourcing Contract for Space Environment Testing
~Starting the demonstration of high-reliability FPC through space environment testing~ Taiyo Techno Rex Co., Ltd. has recently signed a business outsourcing contract with Jinsei Co., Ltd. regarding the space environment testing of our space-use FPC (Flexible Printed Circuit) cables. Our FPC will be mounted on the engineering model of the small satellite "Cubesat" developed by Jinsei, and various tests simulating the space environment will be conducted. This testing is an important initiative aimed at confirming and demonstrating functionality in future orbital operations. In outer space, resistance to extremely harsh conditions such as extreme temperature changes, radiation, and intense vibrations is required. We view this initiative not only as limited to space applications but also as an opportunity to demonstrate FPC technology that exhibits high reliability even under extreme conditions. Moving forward, we will continue to develop and provide high-reliability FPCs with an eye toward expanding into a wide range of fields, including aerospace, industrial equipment, automotive devices, and various inspection equipment, where high quality and reliability are essential.
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【TTL_Exhibition Participation Information】 SPEXA - 【International】 Space Business Exhibition - (Within the Wakayama Prefecture Booth)
**SPEXA - International Space Business Expo Overview** Date: May 27 (Wed) - 29 (Fri), 2026, 10:00 - 17:00 Location: Tokyo Big Sight, South Hall Booth: No. S10-40 (Wakayama Prefecture) **Exhibition Content** ■ Efforts in FPC Development for the Space Industry We are promoting the development of high-reliability FPCs that can withstand harsh environments. By collaborating with and participating in meetings with space-related companies and organizations, we identify needs and propose wiring and processes based on JAXA specifications. ■ FPC We will introduce PI-based compact and lightweight FPCs. We respond to small lot and short delivery time requirements, meeting the needs of satellite development. Our thin, lightweight, and highly flexible designs enhance design freedom, allowing for consistent support from design to processing to implementation and assembly.
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Notice of Participation in the 2nd Kansai NePCON Japan Exhibition
[ Kansai ] Nepcon Japan Overview Date: May 13 (Wednesday) to 15 (Friday), 2026, 10:00 AM to 5:00 PM Location: Intex Osaka, Hall 6 Booth: Space number ▲▲▲ (very close to the keynote speech and open seminar venue)
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Taiyo TechnoRex Co., Ltd. continues to operate in the fields of prototype development of flexible printed circuit boards (FPC) and printed circuit board testing systems. Since FPC is fundamentally related to the structure of hardware, both high precision quality and shortened development time are required. We have extensive experience and know-how in the manufacturing processes of single-sided FPC, double-sided FPC, multilayer FPC, and their advanced types, and we continuously improve and enhance our technology, resulting in consistent evaluations of our delivery times and quality. Additionally, while technically advancing further miniaturization and high density, we are also undertaking new initiatives such as bump-type and special material electroplating. On the other hand, our printed circuit board testing systems mainly consist of electrical inspection systems and final appearance inspection systems, which are adopted in the mass production sites of FPCs and package/module-type substrates. They operate day and night in quality control settings for substrates used in smartphones, automotive applications, and various electronic devices. We will continue to respond to the increasingly diverse market needs. *On December 21, 2023, the company name was changed from "Taiyo Kogyo Co., Ltd." to "Taiyo TechnoRex Co., Ltd."*