38th Electronics Packaging Society Spring Conference Presentation Materials Released
The presentation materials for the 38th Electronics Packaging Society Spring Conference are now available.
The 38th Electronics Packaging Society Spring Conference was held from March 13 (Wednesday) to 15 (Friday), 2024, at the Noda Campus of Tokyo University of Science. At this conference, Mr. Yanagida, the Technical Department Manager of Takaya Corporation's Industrial Equipment Division, gave a presentation on "The Latest Trends in Hybrid Testing Systems Combining JTAG Testing and Flying Probe Testers." The presentation materials from that session have been made available, so please take a look at the related catalog pages below. -------- Content -------- To ensure reliable assembly guarantees for printed circuit boards, electrical testing is essential. However, a single testing method alone does not provide sufficient test coverage. To address this issue, we introduce a hybrid testing system that integrates flying probe testers with JTAG boundary scan testing. By complementing each testing method, we can maximize the test coverage for high-density printed circuit boards, enabling more accurate fault diagnosis.
basic information
Conference Dates March 13 (Wednesday) - 15 (Friday), 2024 *Ended Venue Tokyo University of Science, Noda Campus & Online Hybrid 2641 Yamazaki, Noda City, Chiba Prefecture, 278-8510 Organizing Office (General Incorporated Association) Electronics Packaging Society 3-12-2 Nishiogikita, Suginami-ku, Tokyo, 167-0042 TEL: 03-5310-2010
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Latest Trends in Hybrid Testing Systems Combining JTAG Inspection and Flying Probe Testers
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