39th Electronics Packaging Conference Spring Session Corporate Booth Exhibition

We will exhibit a corporate booth at the 39th Electronics Packaging Society Spring Conference. (Takushoku University Bunkyo Campus)

Takaya Corporation will exhibit a corporate booth at the 39th Spring Conference of the Japan Institute of Electronics Packaging, which will be held from March 11 (Tuesday) to March 13 (Thursday), 2025, at the Bunkyo Campus of Takushoku University. This conference is held annually under the management of the Japan Institute of Electronics Packaging, where the latest research and development results related to electronics packaging technology are presented and information is exchanged. Since 2023, it has been conducted in a hybrid format, allowing both in-person participation and online attendance, attracting around 700 participants, primarily from academia and industry related to electronics packaging technology. When you visit, please be sure to stop by Takaya's booth. (Registration and payment of participation fees are required for attendance.)

39th Electronics Packaging Society Spring Conference Homepage

basic information

Dates: March 11 (Tuesday) - 13 (Thursday), 2025 Venue: Takushoku University Bunkyo Campus (3-4-14 Kohinata, Bunkyo-ku, Tokyo) & Online Organizing Office: Electronics Packaging Society (Incorporated Association) 3-12-2 Nishiogikita, Suginami-ku, Tokyo 167-0042 TEL: 03-5310-2010