July 23, 2024 (Tuesday) 'Soldering and Fine Joining Subcommittee Symposium - Research and Development Trends in Implementation Technologies and Materials Supporting the DX and GX Era'
ゼストロンジャパン
Our company will participate in the "Solder and Fine Joining Subcommittee Symposium - Research and Development Trends in Implementation Technologies and Materials Supporting the DX and GX Era" held by the Japan Welding Society. At this symposium, there will be presentations on the research and development trends of semiconductor devices that support the DX and GX era, as well as the implementation technologies and materials used in them. The Chief Engineer from Zestron Japan Co., Ltd. is scheduled to speak. Additionally, we will introduce new technologies and products, as well as our efforts in the standardization activities of the related cleaning evaluation working group. We hope you will join us.
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Date and time Tuesday, Jul 23, 2024
01:00 PM ～ 05:10 PM
- Capital ■Venue: Japan Welding Society, Welding Hall 2nd Floor ■Address: 4-20 Kanda Sakumacho, Chiyoda-ku, Tokyo 101-0025 ■Nearest Stations - 7 minutes on foot from Exit 1 of "Akihabara Station" on the Tokyo Metro Hibiya Line - 8 minutes on foot from the West Exit of "Asakusabashi Station" on JR ■Capacity - On-site participants: 70 people - Online (Web) participants: 100 people *Registration will be on a first-come, first-served basis, and will close once the capacity is reached.
- Entry fee Charge <Member> 10,000 yen (including text fees and consumption tax), <General> 15,000 yen (including text fees and consumption tax)