ゼストロンジャパン Official site

Added a page on "Evaluation of cleanliness after cleaning: Analysis methods for flux residues and residues after sintering bonding."

ゼストロンジャパン

In recent years, the miniaturization and densification of electronic devices have progressed, and along with this, the evolution of the bonding materials used has also overlapped, making contamination more complex. Particularly in fields such as automotive, aerospace, space, and high-capacity communications, there is an increasing number of cases requiring high reliability, and concurrently, there is a demand for thorough cleaning from the perspective of quality assurance. Inadequate cleaning can lead to issues such as poor wire bonding, inadequate adhesion of resin in molding, and the occurrence of migration, which is a well-known fact. However, in recent years, there have been many cases where defects occur in later processes despite passing inspections, and we have seen an increase in inquiries to our company regarding this issue. Why do such cases arise? This time, we will explain the importance of cleanliness evaluation after cleaning.