Evaluation of cleanliness after cleaning: Analysis methods for flux residues and residues after sintering bonding.
In the cleaning of electronic devices, various factors are intertwined! An explanation of the importance of cleanliness evaluation.
In recent years, the miniaturization and high density of electronic devices have progressed, and along with this, the evolution of the bonding materials used has also coincided, making contamination more complex. In particular, in fields such as automotive, aerospace, space, and high-capacity communication, there is an increasing number of cases that require high reliability, and concurrently, there is a demand for reliable cleaning from the perspective of quality assurance. Inadequate cleaning can lead to issues such as poor wire bonding, poor adhesion of resin in molding, and the occurrence of migration, which is a well-known fact. However, in recent years, there have been many cases where defects occur in later processes despite passing inspections, and we have seen an increase in inquiries to our company regarding this issue. Why do such cases arise? This time, we will explain the importance of cleanliness evaluation after cleaning. *For more detailed information, please refer to the related links. For further inquiries, feel free to contact us.*
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