Package cleaning

Zestron offers water-based and solvent-based cleaning agents for packages such as flip chips, CMOS, and BGA. Zestron's cleaning agents can remove flux residues from the narrow gaps and capillaries between chips and substrates after processes like solder bump reflow. Additionally, they effectively eliminate streaks and particles from camera modules to improve image resolution. By removing flux residues and particles, they maintain optimal wettability of underfill materials. - Flip chip cleaning before underfill for flip chip packages - Void-free underfill for glass filters without residues - CMOS camera module cleaning - BGA and micro BGA cleaning after solder ball processes - BGA and micro BGA cleaning after solder ball processes