Announcement of Free Webinar: Semiconductor Resin Encapsulation Molding "Visualization Solutions for Inside Molds" and IoT Technology (4/20, 4/27, 5/11, 5/18)
Kistler Japan G.K.合同会社 Head office
In the semiconductor industry, particularly in the resin encapsulation process for power semiconductors aimed at NEVs (new energy vehicles), there is an increasing demand for the "visualization" of the internal conditions of molds to achieve zero defects in the manufacturing process. In this webinar, we will propose sensing technologies to improve molding defects using a quartz piezoelectric pressure sensor developed for low-viscosity resins, such as epoxy transfer molding, and for low-pressure measurements. - Low-viscosity resin compatibility ⇒ Structure that does not cause measurement errors due to epoxy resin intrusion (diaphragm structure) - High-temperature compatibility ⇒ Mold temperatures up to 200°C - Linearity (measurement error) ⇒ Less than 1% against the measurement range - Resolution ⇒ 1/1,000 MPa This webinar will be held on the following four dates, but the content will be the same on all dates, so please join us on a day that suits you! April 20, 2022 (Wednesday) April 27, 2022 (Wednesday) May 11, 2022 (Wednesday) May 18, 2022 (Wednesday) Please check the details and register via the registration form. https://info.kistler.com/ja-webinar-semicon We look forward to many participants joining us.

